基于正交设计和灰色关联的硅通孔互连结构随机振动优化设计

发布时间：2018-01-09 11:15

本文关键词：基于正交设计和灰色关联的硅通孔互连结构随机振动优化设计　出处：《焊接学报》2016年07期 　论文类型：期刊论文

【摘要】：建立了硅通孔(TSV,through silicon vias)互连结构三维有限元分析模型,对该模型进行了随机振动分析.以TSV互连结构的最大等效应力、最大等效应变、一阶固有频率、二阶固有频率为目标函数,选取TSV高度、TSV直径、微凸点高度和微凸点直径四个结构参数为设计变量进行多目标正交优化设计,结合灰色关联分析法获得了优化设计的最优参数组合,使TSV互连结构的最大等效应力降低4.59%,最大等效应变降低22.56%,并且一阶固有频率增加了4.91%,二阶固有频率增加了4.46%.结果表明,可以将正交试验法与灰色关联分析法相结合应用于TSV互连结构优化设计,对提高TSV互连结构在随机振动条件下的综合性能具有较高的实用性.
[Abstract]:A three-dimensional finite element analysis model for the via via silicon via silicon interconnect structure is established in this paper. The random vibration analysis of the model is carried out. The maximum equivalent stress, maximum equivalent strain, first order natural frequency and second order natural frequency of the TSV interconnection structure are taken as objective functions, and the TSV height is chosen. The four structural parameters of the microconvex point height and the microconvex point diameter are the design variables for the multi-objective orthogonal optimization design. The optimal parameter combination of the optimization design is obtained by combining the grey relational analysis method. The maximum equivalent stress and the maximum equivalent strain of the TSV interconnection structure are reduced by 4.59 and 22.56 respectively, and the first order natural frequency is increased by 4.91%. The second order natural frequency is increased by 4.46. The results show that the orthogonal test method and the grey correlation analysis method can be applied to the optimal design of TSV interconnection structure. It has high practicability for improving the comprehensive performance of TSV interconnection structure under random vibration condition.
【作者单位】：桂林电子科技大学机电工程学院;成都航空职业技术学院电子工程系;桂林航天工业学院汽车与动力工程系;
【基金】：国家自然科学基金项目(51465012) 广西壮族自治区自然科学基金(2015GXNSFCA139006;2013GXNSFAA019322) 四川省教育厅科研资助项目(13ZB0052)
【分类号】：O327
【正文快照】： 0序言随着电子设备在机载、车载和移动设备上越来越广泛的应用,更多使用TSV互连技术的IC封装器件在高温、高湿和振动等恶劣环境或特定条件下持续工作能力受到越来越广泛的关注,而TSV器件在高温、高湿和振动等恶劣环境或特定条件下持续工作能力受到越来越广泛的关注,而TSV互连

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