高应变率下Ⅱ型应力强度因子的数值模拟
发布时间:2018-11-28 19:54
【摘要】:文章采用有限元软件ANSYS/LS-DYNA程序对静态和冲击荷载作用下的含裂纹半圆弯曲(简称SCB)试验进行了数值模拟。根据静态试验的模拟结果,提出了静态荷载作用下的Ⅱ型应力强度因子拟合公式,其计算误差不超过10%。含复合型裂纹动态SCB试验的模拟结果表明:对于含复合型裂纹的动态加载的SCB试验,动态应力强度因子KⅡ随着试样半径R、裂纹倾角β以及相对裂纹长度a/R的变化呈现规律性变化。当相对裂纹长度a/R在0.4~0.6、裂纹倾角β在10°~40°范围内时,可以直接采用静态公式计算KⅡ,相对误差小于10%。
[Abstract]:In this paper, the finite element software ANSYS/LS-DYNA is used to simulate the semi-circular bending (SCB) test with cracks under static and impact loads. According to the simulation results of static test, the fitting formula of type 鈪,
本文编号:2364095
[Abstract]:In this paper, the finite element software ANSYS/LS-DYNA is used to simulate the semi-circular bending (SCB) test with cracks under static and impact loads. According to the simulation results of static test, the fitting formula of type 鈪,
本文编号:2364095
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