基于机器视觉的激光器封装自动对准系统

发布时间：2018-05-11 10:49

  本文选题：机器视觉 + 非球面透镜　； 参考：《工程设计学报》2017年06期

【摘要】：在半导体激光器封装过程中,针对非球面透镜与半导体激光器的对准过程中存在人工操作精度低、效率低的缺点,开发了一套高精度自动化对准系统。系统以机器视觉技术为基础,配置高性能CCS光源和高分辨率Basler相机,能够实时采集高精度图像;利用累计概率Hough变换和迭代重加权最小二乘法等图像处理算法,快速拟合非球面透镜和半导体激光器的边缘直线,实现自动对准。该系统采集的图像精度达到了亚微米级别,而且在0.5s内便可完成整个对准过程,极大提高了非球面透镜与半导体激光器封装精度与效率。本视觉对准系统基于高性能配置的精确的图像处理算法,对传统的封装技术作出了很大改进,对提高未来半导体激光器封装精度和效率具有较大的推动作用。
[Abstract]:In the process of semiconductor laser packaging, a set of high precision automatic alignment system is developed to overcome the disadvantages of low manual operation precision and low efficiency in the alignment process between aspheric lens and semiconductor laser. On the basis of machine vision technology, the system is equipped with high performance CCS light source and high resolution Basler camera, which can collect high precision images in real time, and make use of image processing algorithms such as cumulative probability Hough transform and iterative reweighted least square method, etc. The edge line of aspherical lens and semiconductor laser is fitted quickly and automatic alignment is realized. The system achieves sub-micron precision, and the whole alignment process can be completed within 0.5 s, which greatly improves the accuracy and efficiency of aspheric lens and semiconductor laser packaging. Based on the accurate image processing algorithm of high performance configuration, this vision alignment system has greatly improved the traditional packaging technology, and has great impetus to improve the accuracy and efficiency of semiconductor laser packaging in the future.
【作者单位】： 中南大学高性能复杂制造国家重点实验室;
【基金】：国家自然科学基金资助项目(51075402;50975293)
【分类号】：TN248.4;TP391.41
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本文编号：1873641