硅藻土基调湿材料中热湿耦合传递
发布时间:2018-10-10 12:31
【摘要】:建立了硅藻土基调湿材料内部热湿耦合迁移一维数学模型,模拟了不同孔隙率、不同环境温度和相对湿度下硅藻土基调湿材料中的热湿耦合迁移过程,结合硅藻土基调湿材料调湿性能实验测试结果以及硅藻土基调湿材料表面的显微图像分析,研究结果表明:随着孔隙率的减小,硅藻土基调湿材料的吸、放湿量均增大;环境温度对硅藻土基调湿材料热湿耦合迁移过程影响不显著,不同的环境温度(最大相差20℃)对硅藻土基调湿材料吸、放湿量的影响均在10%左右;硅藻土基调湿材料的孔径尺寸越小、小孔径孔隙数量越多,其调湿性能越好;硅藻土基调湿材料调湿性能的实测数据、模拟结果以及图像表征吻合良好,从而验证了理论模型的合理性。
[Abstract]:A one-dimensional mathematical model of thermo-moisture coupling migration in diatomite keynote wet material was established, and the coupled heat and humidity migration process in diatomite keynote wet material was simulated under different porosity, different ambient temperature and relative humidity. Combined with the experimental results of moisture adjusting performance of diatomite keynote wet material and the analysis of microscopic image on the surface of diatomite keynote wet material, the results show that: with the decrease of porosity, the moisture absorption and desiccant amount of diatomite keynote wet material increase; The effect of ambient temperature on the thermal-moisture coupling migration process of diatomite was not significant. The effect of different ambient temperature (maximum difference of 20 鈩,
本文编号:2261774
[Abstract]:A one-dimensional mathematical model of thermo-moisture coupling migration in diatomite keynote wet material was established, and the coupled heat and humidity migration process in diatomite keynote wet material was simulated under different porosity, different ambient temperature and relative humidity. Combined with the experimental results of moisture adjusting performance of diatomite keynote wet material and the analysis of microscopic image on the surface of diatomite keynote wet material, the results show that: with the decrease of porosity, the moisture absorption and desiccant amount of diatomite keynote wet material increase; The effect of ambient temperature on the thermal-moisture coupling migration process of diatomite was not significant. The effect of different ambient temperature (maximum difference of 20 鈩,
本文编号:2261774
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