LCD真空贴合基板吸附和剥离关键技术的研究

发布时间：2018-10-23 15:40

【摘要】：TFT-LCD(Thin Film Transistor Liquid Crystal Display)是主流的平板显示技术,TFT-LCD生产设备的技术性能决定着液晶显示面板的生产工艺水平。中航光电子液晶显示面板向小尺寸转型,部分设备的性能不能满足小尺寸面板的工艺技术要求。本文针对真空贴合设备在对应小尺寸面板时面板存在显示漏光和液晶屏气泡的问题,对真空贴合设备工艺流程、真空条件下基板吸附和剥离技术开展研究,做了以下的研究工作:真空贴合制品缺陷分析和新工艺模型建立,论文分析了真空贴合设备结构和工艺原理,提出了表征基板贴合精度的工艺参数,分析了液晶面板显示漏光和液晶屏气泡缺陷产生的原因,建立了新的工艺模型,对真空贴合设备提出了改进的设计方案,并分析了其实现的可行性。基板吸附和剥离单元的设计和可靠性验证,设计新型的粘性橡胶吸附单元和高压气囊剥离单元,通过实验验证了其动作的可靠性,通过制品验证了新型基板吸附和剥离单元不会造成面板不良。定盘和电气系统的设计,设计了SDC(Stick Diaphragm Chuck)基板吸附和剥离单元定盘和电气系统,使其满足基板吸附和剥离动作的要求。控制程序及人机界面设计,设计了控制程序和触摸屏人机界面,使真空贴合设备的动作时序满足新工艺流程的要求。总装及设备性能测试,进行了真空贴合设备总装和系统调试,通过量产测试验证了真空贴合设备改进和新工艺模型的有效性。
[Abstract]:TFT-LCD (Thin Film Transistor Liquid Crystal Display) is the mainstream flat panel display technology. The technical performance of TFT-LCD equipment determines the production process level of LCD panel. The optoelectronic liquid crystal display panel of CAAC is transformed to small size, and the performance of some equipments can not meet the technical requirements of small size panel. In this paper, aiming at the problem of showing light leakage and liquid crystal screen bubble in the panel of vacuum bonding equipment when it corresponds to small panel, the technological process of vacuum bonding equipment and the technology of substrate adsorption and stripping under vacuum condition are studied in this paper. The following research work is done: defect analysis of vacuum bonding products and establishment of new process model. The structure and process principle of vacuum bonding equipment are analyzed, and the process parameters to characterize the precision of substrate bonding are put forward. The causes of light leakage and bubble defects in liquid crystal panel display are analyzed, a new process model is established, an improved design scheme for vacuum bonding equipment is put forward, and the feasibility of its realization is analyzed. The design and reliability verification of the substrate adsorption and stripping unit, the design of the new viscous rubber adsorption unit and the high pressure air bag stripping unit, and the reliability of the operation of the unit are verified by experiments. It is proved by the products that the new type of substrate adsorption and stripping unit will not cause the panel to be bad. The design of the fixed disk and electrical system, and the design of the SDC (Stick Diaphragm Chuck) substrate adsorption and stripping unit fixed disc and electrical system to meet the needs of the substrate adsorption and stripping action. The control program and man-machine interface are designed, and the control program and touch screen interface are designed to meet the requirements of the new process. Final assembly and equipment performance test, vacuum bonding equipment assembly and system debugging, through mass production test to verify the improvement of vacuum bonding equipment and the effectiveness of the new process model.
【学位授予单位】：上海交通大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TN873.93

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