新一代智能手机芯片产品规划及其设计成本分析研究

发布时间：2018-10-25 09:03

【摘要】：面向第四代移动通信技术标准LTE(Long Term Evolution长期演进技术)的集成通信基带处理功能与移动计算处理能力于一体的新一代智能手机芯片,是移动终端的核心部件,其功能众多,芯片设计集中体现出SOC(System on Chip简称SOC)技术,是当前芯片设计行业的最大挑战,也是本课题的研究焦点。智能手机迎来革命,而功能集成化、性能电脑化、通信多模化、平台一致化、产品同质化成为新时代智能手机芯片的主要特点。与此相对应的移动终端朝着轻薄化、大屏化、低价化趋势发展,导致功耗与性能之间矛盾越来越突出,产品同质化导致产品生命周期越来越短。如何提前做好芯片的产品规划及设计成本的预测与分析显得尤为重要。本文结合作者实际工作对这两个问题进行了分析和阐述。国内外对于LTE通信终端基带处理技术有不少相关研究,但具体与应用处理器相结合的针对智能手机芯片的报告则相对较少。而从产品规划和成本分析方面着眼进行分析的更是凤毛麟角。本文结合联芯科技在TD-SCDMA及LTE终端基带芯片设计方面的研究基础,通过分析,认为该SOC芯片工艺节点应该选择28nnm,封装应选择Flip-chip BGA,通信模式则至少支持五种制式,暨GSM/TDSCDMA/LTE-TDD/LTE-FDD/WCDMA。通过一套成本分析工具能够实现设计之前对目标成本有清晰的估算,做到有的放矢。同时,本论文以本课题研究中的无线连接芯片设计实例进行了说明,阐明了产品规划对应的设计实现,互为印证。本论文的研究工作主要采用信息收集、归纳总结、数据统计和参数假设等方法进行。本人查找了国内外大量的技术资料、市场分析和产业报告,总结了新一代智能手机芯片所涉及到的关键技术、通信标准以及成本分析的方法,进而对芯片的产品规划提出清晰的思路和目标。通过本项目的研究,可以得出新一代智能手机芯片的产品规划思路和结论,为芯片设计提供目标指导。通过对芯片设计成本的分析,能够给出可量化的成本分解及计算工具,为快速进行成本评估提供了依据。
[Abstract]:The integrated communication baseband processing function and mobile computing processing capability are the core components of mobile terminal, which is the core component of mobile terminal, and has many functions, which is oriented to the long-term evolution of the fourth generation mobile communication technology standard (LTE (Long Term Evolution). Chip design embodies SOC (System on Chip (SOC) technology, which is the biggest challenge of chip design industry and the research focus of this topic. Smart phone ushered in a revolution, and the main features of smart phone chips in the new era are integration of functions, computerization of performance, multimode communication, consistent platform and homogenization of products. The corresponding mobile terminals are developing towards thinning, large screen and low price, which leads to more and more contradiction between power consumption and performance, and product homogenization leads to shorter and shorter product life cycle. It is very important to predict and analyze the product planning and design cost in advance. This paper analyzes and expounds these two problems in combination with the author's practical work. There are many related researches on baseband processing technology of LTE communication terminal at home and abroad, but there are relatively few reports on smart phone chips combined with application processors. But from the product plan and the cost analysis aspect carries on the analysis to be more rare. Based on the research foundation of TD-SCDMA and LTE terminal baseband chip design, this paper considers that the process node of the SOC chip should select 28nnm, and the package should choose Flip-chip BGA, communication mode to support at least five kinds of systems, and GSM/TDSCDMA/LTE-TDD/LTE-FDD/WCDMA.. Through a set of cost analysis tools, the target cost can be estimated clearly before the design. At the same time, the design example of wireless connection chip in this thesis is introduced, and the corresponding design realization of product planning is explained. Information collection, induction, data statistics and parameter hypothesis are used in this paper. I have looked up a lot of technical data, market analysis and industry report at home and abroad, summed up the key technologies, communication standards and cost analysis methods involved in the new generation of smart phone chips. Then the chip product planning and clear ideas and objectives. Through the research of this project, we can get the product planning idea and conclusion of the new generation smart phone chip, and provide the target guidance for the chip design. By analyzing the design cost of the chip, a quantifiable cost decomposition and calculation tool can be provided, which provides the basis for rapid cost evaluation.
【学位授予单位】：中国科学院大学（工程管理与信息技术学院）
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TN929.53

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