激光的强化因子和入射距离对铜薄膜能量衰减影响分析

发布时间：2018-02-23 00:46

本文关键词： 激光冲击铜薄膜能量衰减数学模型分析　出处：《激光杂志》2017年06期 　论文类型：期刊论文

【摘要】：微机械电子系统中的铜薄膜分布很广,为了改进微机械电子系统的构件性能、延长使用寿命,提出一种激光冲击铜薄膜的能量衰减数学模型分析新方法。所提方法通过改进Kanai模型给出激光冲击铜薄膜的能量衰减数学模型,使用两步回归处理方法确定模型回归系数,保证模型回归精度。在模型的基础上,以激光入射周期为横坐标、多种类构件面积归一化结果为纵坐标,绘制铜薄膜吸收能量衰减和铜薄膜滞回能量衰减影响曲线图,根据曲线分析出构件面积、激光强化因子和激光入射距离对铜薄膜能量衰减的影响规律。实验结果说明,所提新方法的模型回归精度高,分析结果更加可靠。
[Abstract]:Copper thin films are widely distributed in micromachined electronic systems. In order to improve the performance of components and prolong the service life of micromechanical electronic systems, A new method for analyzing the energy attenuation mathematical model of laser shock copper thin film is proposed. The improved Kanai model is used to obtain the energy attenuation model of the laser shock copper film, and the regression coefficient of the model is determined by using the two-step regression method. On the basis of the model, the laser incident period is taken as the horizontal coordinate and the area normalization result of various kinds of components is the vertical coordinate. The curves of the absorption energy attenuation of copper film and the hysteresis energy attenuation of copper film are plotted. According to the curve, the influence of component area, laser hardening factor and laser incident distance on the energy attenuation of copper thin film is analyzed. The experimental results show that the new method has higher regression accuracy and more reliable analysis results.
【作者单位】：黄淮学院数学与统计学院;
【基金】：2016年河南省高等学校重点科研项目(16A110005)
【分类号】：TH-39;TN249

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