微玻璃半球谐振陀螺的结构设计及工艺研究

发布时间：2018-01-07 20:28

本文关键词：微玻璃半球谐振陀螺的结构设计及工艺研究　出处：《中北大学》2017年硕士论文　论文类型：学位论文

【摘要】：半球谐振陀螺是利用Coriolis效应工作的振动惯性器件,由于这种陀螺具有较高的精度和可靠性,而且拥有较长的工作寿命,所以其极具发展潜力。MEMS是将微电子技术与机械工程融合在一起的一种工业技术,其具有微型化、智能化、多功能、高集成度和适于大批量生产的特点。本论文提出了基于MEMS技术的微型玻璃半球谐振陀螺的设计构想,设计并制备出不同结构的微型玻璃半球谐振陀螺,具有高性能、小体积和低成本的优点。本文首先介绍了微型半球谐振陀螺的研究背景和国内外现状,分析了半球谐振陀螺的工作原理。在此基础上,本文提出了基于吹塑成型的微玻璃半球谐振子结构,并通过有限元仿真对微玻璃半球谐振子进行了模态分析和谐响应分析,得到其谐振频率;提出了环形电极和硅电极两种结构,对两种电极结构与谐振子的有效平均距离进行了计算。然后针对上述微玻璃半球谐振子结构及电极结构特点,分别设计了基于同步吹塑成型和基于硅-玻璃-硅三层阳极键合的微玻璃半球谐振陀螺的工艺制备流程,并完成了芯片的加工制备。最后,利用扫描电子显微镜和原子力显微镜对微玻璃半球谐振陀螺进行形貌表征,分析表明基于同步吹塑成型的微玻璃半球谐振子与环形电极的距离为73微米,基于硅-玻璃-硅三层阳极键合的微玻璃半球谐振子与硅电极的距离为8±2微米,谐振子的平均表面粗糙度Ra为0.217纳米,环形电极与谐振子形成的电容值Cc为0.07226pF,硅电极与半球谐振子间的电容为C_s为0.927pF,均在合理的参数范围内。
[Abstract]:Hemispherical resonator gyroscope is a vibratory inertial device which uses Coriolis effect because of its high precision reliability and long working life. Therefore, MEMS is a kind of industrial technology which combines microelectronics technology with mechanical engineering. It has miniaturization, intelligence and multi-function. High integration and suitable for mass production. In this paper, the design concept of micro glass hemispherical resonator gyroscope based on MEMS technology is proposed, and different structures of micro glass hemisphere resonator gyro are designed and fabricated. It has the advantages of high performance, small volume and low cost. Firstly, this paper introduces the research background and the present situation at home and abroad of the micro hemispherical resonator gyroscope, and analyzes the working principle of the micro hemispherical resonator gyroscope. In this paper, the structure of micro glass hemispherical resonator based on blow molding is proposed, and the harmonic response of micro glass hemispherical harmonic oscillator is analyzed by finite element simulation, and the resonant frequency is obtained. Two kinds of structures, ring electrode and silicon electrode, are proposed. The effective average distance between the two kinds of electrode structures and harmonic oscillator is calculated. The fabrication process of micro-glass hemispherical resonant gyroscope based on synchronous blow molding and three-layer anode bonding of silicone-glass-silicon was designed, and the fabrication of the chip was completed. Finally. Scanning electron microscope (SEM) and atomic force microscope (AFM) were used to characterize the microglass-sphere resonator gyroscope. The results showed that the distance between the microglass-sphere resonator and the ring electrode was 73 渭 m. The distance between the microglass-sphere harmonic oscillator and the silicon electrode is 8 卤2 渭 m, and the average surface roughness of the resonator is 0.217 nm based on the silicon-glass-silicon three-layer anodic bonding. The capacitance of ring electrode and harmonic oscillator is 0.07226pF, and the capacitance between silicon electrode and hemispherical oscillator is 0.927pF, which is within the reasonable parameter range.
【学位授予单位】：中北大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN96

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