矩形同轴金属传输线工艺研究

发布时间：2018-05-18 14:43

本文选题：微同轴 + 传输线　；参考：《合肥工业大学》2017年硕士论文

【摘要】：近年来,机载雷达、低空导弹系统、相控阵雷达等的发展对微波电路提出了高集成化的要求,用来减少装备体积和重量,提高可靠性并改善频带。单片微波集成电路凭借高集成度、低成本、高性能的优势在微波集成电路中脱颖而出。矩形同轴金属传输线是实现单片微波集成电路小型化、轻质化的关键,此微结构是复杂的微米级三维立体结构,其微加工工艺颇为复杂,基于此开展了矩形同轴金属微结构的加工工艺研究。基于UV-LIGA工艺技术,结合BPN和SU-8紫外负性光刻胶加工制备矩形同轴金属传输线的微结构。此微结构利用BPN负性光刻胶制备出胶膜微结构;采用SU-8负性光刻胶制备微结构内导体的支撑体;利用微电铸对胶膜微结构电铸金属层;最后将BPN胶膜微结构剥离,即可得到矩形同轴传输线的金属微结构。首先本文就加工工艺具体流程进行设计,对比逐层叠加工艺技术、间接键合技术以及外导体一次成型工艺三种微加工工艺方案,在外导体一次成型工艺技术的基础上进行优化,制定了操作步骤简单,成品优良,周期短的工艺方案;然后就实验过程中出现的胶膜成型难,铸层粗糙等关键问题进行分析,并提出了相应的解决方案;最后对加工的矩形微同轴样品进行质量检测,主要包括壁厚、整体高度、总体长度、内导体宽度和侧壁倾斜度等,检测结果表明其加工尺寸在可接受的误差范围之内,表面形貌和整体轮廓较为理想。
[Abstract]:In recent years, the development of airborne radar, low-altitude missile system and phased array radar has put forward the requirement of high integration of microwave circuit, which is used to reduce the volume and weight of equipment, improve reliability and improve the frequency band. Monolithic microwave integrated circuits stand out in microwave integrated circuits with the advantages of high integration, low cost and high performance. Rectangular coaxial metal transmission line is the key to realize the miniaturization and lightness of monolithic microwave integrated circuit. Based on this, the processing technology of rectangular coaxial metal microstructure is studied. Based on UV-LIGA technology, the microstructure of rectangular coaxial metal transmission line was fabricated by BPN and SU-8 UV negative photoresist processing. The microstructures are prepared by using BPN negative photoresist, the support of the inner conductors of the microstructures are prepared by SU-8 negative photoresist, the metal layers of the microstructures are electroformed by microelectroforming, and the microstructures of the BPN films are finally stripped off. The metal microstructures of rectangular coaxial transmission lines can be obtained. First of all, this paper designs the specific process flow, compares three kinds of micromachining technology, such as layer by layer superposition technology, indirect bonding technology and one forming process of outer conductor, and optimizes the technology of outer conductor once forming. The process plan with simple operation steps, excellent finished product and short cycle is worked out, and then the key problems such as difficult forming of rubber film and rough cast layer are analyzed, and the corresponding solutions are put forward. Finally, the quality of the rectangular microcoaxial samples is tested, including wall thickness, overall height, total length, inner conductor width and sidewall inclination, etc. The results show that the machining size is within the acceptable error range. The surface morphology and overall outline are ideal.
【学位授予单位】：合肥工业大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN811

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