面向物联网的核心板方案的设计与研究

发布时间：2018-05-21 03:09

本文选题：物联网 + 核心板　；参考：《山东大学》2017年硕士论文

【摘要】：近年来,随着物联网的飞速发展,万物互联的趋势越来越显著,各种智能设备的研发需求越来越多,而无论是4G通信技术,还是智能器件的应用,智能设备研发的难度,已经成为物联网的发展的瓶颈。为了解决这个问题,利用消费类电子的技术方案,研发一款支持4G全网通的核心板。核心板承载了大部分的研发任务,提供给物联网设备厂家,他们根据自身需求进行简单的二次开发即可。本文从物联网设备的需求出发,确认核心板的规格,从而搭建合适的原理图,进行PCB的设计。在核心板PCB设计过程中,必然要面对电磁干扰的问题。结合项目具体的设计研究,论文对核心板的开发过程和主要技术进行了详细的总结介绍。主要内容包括:1.介绍核心板采用的芯片方案,对各主要芯片的功能进行简单的介绍,并给出系统框架图。2.确定核心板的外围接口并进行详细的介绍,也总结相关接口的设计规则。此外,设计了一套4G全网通的解决方案,并给出相关的架构图。3.对核心板的EMC设计进行研究总结。从叠层结构、阻抗控制、器件布局以及射频部分EMC设计等多个方面进行了深入研究,在已有EMC设计经验的基础上,根据实际设计情况,提出一些新的设计方法。4.研究电源完整性设计,总结PDN设计中的的多个要点。设计完成之后通过软件仿真来验证,并不断修改设计以保证最终满足PDN设计的阻抗要求。5.给出核心板各层设计图,并提供核心板相关的生产测试工装设计。
[Abstract]:In recent years, with the rapid development of the Internet of things, the trend of interconnection of all things becomes more and more obvious, and the research and development needs of various intelligent devices are more and more, and whether 4G communication technology or the application of smart devices, the research and development of intelligent devices is difficult. Has become the bottleneck of the development of the Internet of things. In order to solve this problem, a core board supporting 4G All-Netcom is developed using the technology of consumer electronics. The core board carries most of the research and development tasks and provides to the Internet of things equipment manufacturers, they can carry out simple secondary development according to their own needs. Based on the requirements of the Internet of things, this paper confirms the specification of the core board, and builds a suitable schematic to design the PCB. In the process of core board PCB design, electromagnetic interference is inevitable. Combined with the specific design of the project, the development process and main technology of the core board are summarized and introduced in detail. The main contents include: 1. This paper introduces the chip scheme used in the core board, briefly introduces the functions of the main chips, and gives the system frame diagram. 2. 2. The peripheral interface of the core board is determined and introduced in detail, and the design rules of the related interface are also summarized. In addition, a solution of 4G All-Netcom is designed, and the related architecture diagram. 3. 3. The EMC design of the core board is summarized. In this paper, the stack structure, impedance control, device layout and RF part EMC design are studied in detail. Based on the experience of EMC design, some new design methods .4. This paper studies the power integrity design and summarizes several key points in the PDN design. After the design is completed, it is verified by software simulation, and the design is constantly modified to ensure that the impedance requirement of PDN design is finally met. The design drawings of each layer of the core board are given, and the design of the production test tools related to the core board is provided.
【学位授予单位】：山东大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TP391.44;TN929.5;TN41

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