移动通信印制电路高密度精细线路制作技术的研究
发布时间：2018-07-16 13:09
【摘要】：随着4G通信时代的到来以及5G通信的提出,移动通信技术以及移动通信设备发生着翻天覆地的变化。移动通信的信号传输频率与传输速率的不断的提高,要求移动通信印制电路板中的精细线路具有规整的形状以及平滑的表面;移动通信设备体积的不断减小以及IC半导体器件I/O接口的增多要求印制电路板中精细线路的密度越来越高。本文首先研究了减成法制作工艺对蚀刻参数进行了优化,以蚀刻因子和侧蚀量作为实验指标,抗蚀层厚度,线路铜层的厚度,蚀刻液的喷淋压力作为实验因素进行正交实验对蚀刻因素进行优化,获得了减成法蚀刻过程中的最佳参数。在最佳参数下,最大的蚀刻因子为4.90,最小的侧蚀量为1.98μm。这一结果能够满足4G移动通信印制电路板的需求,然而随着5G通信的到来,移动通信印制电路板的精细线路发展到35μm以下,减成法不能满足这样精细的线路制作要求,新的精细线路制作方法成为移动通信发展的必然。通过比较,半加成法是移动通信印制电路高密度精细线路的理想制作方法。针对半加成法种子层基材结合力不好或者沉积成本太贵的缺点,本文提出了以镍作为种子层的新型半加成法。化学镀镍的沉积速率影响生产效率,本文采用单因素实验优化了化学镀镍的沉积速率,得到最优的参数为:活化时间15分钟,主盐的浓度为25g/L,还原剂的浓度为35g/L,镀液pH值为8.5,施镀温度为85℃。选择型号为SZ-1235的杜邦干膜作为抗电镀干膜;选取电流密度为0.8A/dm2,电镀时间为120分钟;选择厚度为2μm的化学镍层作为种子层,快速蚀刻时间选择为2分钟。在镍层上制作精细线路后用金相显微镜、扫描电子显微镜、剥离强度测试检测了精细线路的结果。检测发现,线路的表面和侧面平整光洁,线路层与基材之间结合紧密,线路截面形状非常规整,计算线路的蚀刻因子,各组精细线路的蚀刻因子基本能达到8以上。精细线路的剥离强度测试结果都满足IPC(Institute of Printed Circuits,印制电路协会)的品质要求。对比减成法和普通半加成法,本实验制作的精细线路蚀刻因子更高,线路截面形状比普通半加成法更加规整,显然更加适合与移动通信印制电路板的生产。
[Abstract]:With the coming of 4G communication era and the proposal of 5G communication, mobile communication technology and mobile communication equipment are changing dramatically. The continuous improvement of the signal transmission frequency and transmission rate of mobile communication requires that the fine lines in the printed circuit board of mobile communication have regular shape and smooth surface. With the decrease of the volume of mobile communication devices and the increase of I / O interface of IC semiconductor devices, the density of fine circuits in printed circuit boards (PCB) is getting higher and higher. In this paper, the etching parameters are optimized by subtraction method. Etch factor and side etching amount are taken as the experimental indexes, the thickness of corrosion resistance layer and the thickness of copper layer on line are studied. The spray pressure of the etching solution was used as the experimental factor to optimize the etch factors and the optimum parameters in the process of subtraction etching were obtained. Under the optimum parameters, the maximum etching factor is 4.90 and the minimum side etching amount is 1.98 渭 m. This result can satisfy the demand of 4G mobile communication printed circuit board. However, with the arrival of 5G communication, the fine circuit line of mobile communication printed circuit board develops below 35 渭 m. The new fine line manufacturing method is inevitable for the development of mobile communication. By comparison, the semi-addition method is an ideal method for manufacturing high density fine circuit of printed circuit of mobile communication. A new semi-addition method with nickel as seed layer is proposed in this paper to overcome the disadvantage of poor adhesion or expensive deposition cost of seed layer by semi-addition method. The deposition rate of electroless nickel plating affects the production efficiency. In this paper, the deposition rate of electroless nickel plating is optimized by single factor experiment. The optimum parameters are as follows: activation time 15 minutes. The concentration of main salt is 25g / L, the concentration of reductant is 35g / L, the pH value of bath is 8.5, and the plating temperature is 85 鈩，
本文编号：2126486
[Abstract]:With the coming of 4G communication era and the proposal of 5G communication, mobile communication technology and mobile communication equipment are changing dramatically. The continuous improvement of the signal transmission frequency and transmission rate of mobile communication requires that the fine lines in the printed circuit board of mobile communication have regular shape and smooth surface. With the decrease of the volume of mobile communication devices and the increase of I / O interface of IC semiconductor devices, the density of fine circuits in printed circuit boards (PCB) is getting higher and higher. In this paper, the etching parameters are optimized by subtraction method. Etch factor and side etching amount are taken as the experimental indexes, the thickness of corrosion resistance layer and the thickness of copper layer on line are studied. The spray pressure of the etching solution was used as the experimental factor to optimize the etch factors and the optimum parameters in the process of subtraction etching were obtained. Under the optimum parameters, the maximum etching factor is 4.90 and the minimum side etching amount is 1.98 渭 m. This result can satisfy the demand of 4G mobile communication printed circuit board. However, with the arrival of 5G communication, the fine circuit line of mobile communication printed circuit board develops below 35 渭 m. The new fine line manufacturing method is inevitable for the development of mobile communication. By comparison, the semi-addition method is an ideal method for manufacturing high density fine circuit of printed circuit of mobile communication. A new semi-addition method with nickel as seed layer is proposed in this paper to overcome the disadvantage of poor adhesion or expensive deposition cost of seed layer by semi-addition method. The deposition rate of electroless nickel plating affects the production efficiency. In this paper, the deposition rate of electroless nickel plating is optimized by single factor experiment. The optimum parameters are as follows: activation time 15 minutes. The concentration of main salt is 25g / L, the concentration of reductant is 35g / L, the pH value of bath is 8.5, and the plating temperature is 85 鈩，
本文编号：2126486
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