通信机柜半导体制冷装置的性能测试

发布时间：2018-08-30 18:14

【摘要】：本文设计了一种可用于通信机柜的半导体冷却装置,搭建了测试平台测试分析了散热量及冷却效率。根据测试结果分析了该半导体冷却装置在空气冷却工况下的散热量、冷却效率及影响因素,得到性能评价参数。结果表明:当环境平均温度为26℃且输入功率在200~360 W范围内时,装置的冷却效率先增大后减小,在输入功率为232 W时冷却效率达到最大值69.5%,制冷小室平均散热量为455.45 kJ,半导体冷却装置的冷却功率为151.8 W,且在相同条件下该装置可以带走5 kW通信机柜3.04%的热量。
[Abstract]:In this paper, a kind of semiconductor cooling device can be used in communication cabinet is designed, and the test platform is set up to test and analyze the heat dissipation and cooling efficiency. According to the test results, the heat dissipation, cooling efficiency and influencing factors of the semiconductor cooling device under the air cooling condition are analyzed, and the performance evaluation parameters are obtained. The results show that when the average ambient temperature is 26 鈩，

本文编号：2213891