电子封装模具均匀加热与恒温控制技术研究

发布时间：2018-04-03 05:21

本文选题：电子封装　切入点：模具　出处：《南京航空航天大学》2017年硕士论文

【摘要】：电子封装塑封模具表面存在温差或温度控制不够精确时,对封装外壳进行热压成型时会造成封装塑料(如环氧树脂薄膜)翘曲和失效,使得产品报废。电子封装模具的均匀加热和恒温控制技术可减小封装模具表面的温差并提高温度控制的精度,从而改善封装的热压成型工艺,提高产品合格率。本文以设计电子封装机的模具加热结构和恒温控制系统为研究内容,研究的目的在于减小封装模具表面的温差并提高温度控制的精度,以此满足封装工艺的要求。主要研究内容有:(1)针对模具表面存在温差的问题,根据模具的结构设计其加热结构,并通过分区加热设计减小模具表面的温差,最后使用ANSYS进行热场分析,理论上验证设计效果。(2)针对温度控制的精度问题,通过机理分析法建立模具加热过程的数学模型,选择使用遗传算法通过响应曲线对数学模型进行参数辨识,最终确定模具加热过程的传递函数;基于温度控制系统具有时滞的特性,选择使用模糊PID-史密斯预估补偿控制算法提高温度控制的精度并把算法具体实现,最终使用MATLAB仿真分析理论上验证了设计效果。(3)进行恒温控制系统的硬件设计和软件设计,做出整套温度控制系统的解决方案。(4)进行系统调试和实验,验证设计方案是否达到设计指标。
[Abstract]:When there is temperature difference on the surface of electronic packaging die or the temperature control is not accurate, the packaging plastic (such as epoxy resin film) will be warped and invalidated when the package shell is hot pressed, and the product will be scrapped.The uniform heating and constant temperature control technology of electronic packaging die can reduce the temperature difference of the die surface and improve the precision of temperature control, thus improving the hot pressing forming process of the package and increasing the qualified rate of the product.In this paper, the design of die heating structure and constant temperature control system of electronic sealing machine is studied. The purpose of the research is to reduce the temperature difference on the surface of packaging die and improve the precision of temperature control, so as to meet the requirements of packaging technology.Aiming at the problem of temperature difference on the surface of die, the heating structure is designed according to the structure of die, and the temperature difference of mold surface is reduced by zone heating design. Finally, the thermal field is analyzed by ANSYS.In view of the precision of temperature control, the mathematical model of mold heating process is established by mechanism analysis method, and the parameter identification of mathematical model is carried out by using genetic algorithm through response curve.Finally, the transfer function of the mold heating process is determined. Based on the time-delay characteristic of the temperature control system, the fuzzy PID-Smith predictive compensation control algorithm is chosen to improve the precision of the temperature control, and the algorithm is realized concretely.Finally, the MATLAB simulation analysis is used to verify the design effect. The hardware design and software design of the thermostatic control system are carried out, and the solution of the whole temperature control system is made. The system is debugged and experimented.Verify that the design plan meets the design targets.
【学位授予单位】：南京航空航天大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TQ320.52;TP273

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