热光效应器件加热互连线丢失物缺陷分析与设计优化研究

发布时间：2018-02-28 10:16

本文关键词： 热光效应器件加热互连线丢失物缺陷有限元仿真　出处：《湖北工业大学》2017年硕士论文　论文类型：学位论文

【摘要】：随着金属薄膜制备技术和聚合物材料学科的发展,热光效应光电器件因其独特的工作原理和诸多优势而备受关注。然而,由于器件小型化和集成度的不断提高,热光效应器件加热互连线的尺寸已达到纳米级别,增加制造工艺的难度和缺陷发生的概率,极大的影响了器件的可靠性。本文基于热光效应器件的工作原理,针对器件失效的薄弱环节——加热互连线,结合理论研究、仿真分析、试验结果,探究丢失物缺陷对互连线寿命和器件性能的影响。另外,针对光纤通道、互连线不断增加情况,探究多根互连线之间的交互作用,并提出优化意见。首先,结合热光器件的工作环境,基于故障物理学、试验研究,确定其失效机理为以电迁移为主的多物理场的共同作用。运用电迁移理论分析丢失物缺陷对多物理场下各种迁移机制的影响,与互连线寿命、失效位置之间的关系。为接下来的仿真模型创建和试验设计提供依据。其次,根据理论研究,运用ANSYS有限元仿真软件建立以硅为衬底的具有丢失物缺陷的互连线工作模式,通过热-电耦合仿真结果,得出电流密度、温度、温度梯度分布,对比完好互连线相关参数,明确丢失物缺陷大小和位置与互连线寿命和失效位置之间的关系。另外根据热光效应器件的实际结构,分析加热互连线存在丢失物缺陷时,聚合物光波导的温度分布情况,多根互连线在不同间距下的交互作用。仿真结果表明:丢失物缺陷缺陷对互连线寿命和器件性能影响极大;互连线间距越小,交互作用越强,在聚合物光波导中添加隔热材料可有效改善交互作用、优化器件尺寸。最后,制备互连线试验样品,运用光镜等检测设备观测样品,并对样品缺陷类型经行分类。针对具有丢失物缺陷的样品进行加速寿命试验,试验结果表明:(1)互连线直线部分存在丢失物缺陷时,失效位置也在缺陷处;(2)丢失物缺陷越大,寿命越短;(3)对于一定深度以内的划痕缺陷,失效是有电迁移导致的,超过一定范围失效形式表现为过电应力。
[Abstract]:With the development of metal thin film preparation technology and polymer materials, thermo-optical photovoltaic devices have attracted much attention due to their unique working principles and many advantages. However, due to the miniaturization of the devices and the continuous improvement of integration, The dimension of the heating interconnect of thermo-optical devices has reached the nanometer level, which increases the difficulty of manufacturing process and the probability of defect occurrence, which greatly affects the reliability of the devices. In view of the weak link of device failure, heating interconnect, combined with theoretical research, simulation analysis and test results, the influence of missing object defects on interconnect life and device performance is explored. This paper explores the interaction between multiple interconnects, and puts forward some suggestions for optimization. Firstly, combining with the working environment of thermo-optic devices, based on the fault physics, the experimental research is carried out. It is determined that the failure mechanism is the common action of the multi-physical field which is dominated by electromigration. The influence of the defects of the lost object on the various migration mechanisms under the multi-physical field is analyzed by using the electromigration theory, and the interconnect lifetime is also analyzed. The relationship between the failure locations provides the basis for the following simulation model creation and experimental design. Secondly, according to the theoretical research, the ANSYS finite element simulation software is used to establish the inter-connection operation mode with missing material defects based on silicon substrate. The current density, temperature and temperature gradient distribution are obtained by thermoelectric coupling simulation. The relationship between the size and position of the missing object defect and the life and failure position of the interconnect is clarified. According to the actual structure of the thermo-optic device, the temperature distribution of the polymer optical waveguide is analyzed when the missing material defect exists in the heating interconnect line. The simulation results show that the missing defect has a great influence on the interconnect life and device performance, and the smaller the interconnect distance, the stronger the interaction. Adding heat insulation material to polymer optical waveguide can effectively improve the interaction and optimize the device size. Finally, the interconnect test sample is prepared, and the sample is observed by optical microscope, etc. The accelerated life test for the sample with missing material defect shows that when there is a missing object defect in the linear part of the interconnection line, the failure position is also at the defect point and the loss defect is larger. The shorter the life is, the shorter the life is. For the scratch defect within a certain depth, the failure is caused by electric migration, and the form of failure beyond a certain range is overcurrent stress.
【学位授予单位】：湖北工业大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN405.97

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