陶瓷微热板气体传感器阵列及检测系统研究
本文关键词:陶瓷微热板气体传感器阵列及检测系统研究 出处:《哈尔滨理工大学》2015年博士论文 论文类型:学位论文
更多相关文章: 微机电系统 传感器阵列 气体传感器 陶瓷微热板 热失稳
【摘要】:目前,我国是世界最大的能源化工原料的生产和消费国家。能源与化工原料的生产和运输安全形势非常严峻,能源化工领域危化品泄漏爆炸事故频发,工农业中有毒有害气体的排放导致大气污染程度日益突出,要求快捷有效的检测手段不断提高,其中,危化品中有毒有害气体的检测技术尤为迫切。采用传统的传感器检测具有体积大、功耗高、缺乏集成化等缺陷,已无法满足现代智能化、网络化安全检测的需要。而采用MEMS传感器阵列技术可以满足气体传感器的微型化、集成化、低功耗检测要求。MEMS硅基工艺的体硅刻蚀技术主要适用于微机械量传感器,在硅基微热板气体传感器及阵列中存在多种成膜工艺复杂、兼容性差、热失配等缺陷。而陶瓷微热板传感器及阵列技术具有工艺简单、膜基结合性及热匹配性好优点,有利于纳米敏感材料的结合。特别是优良的机械加工性能,较高的介电系数,在结构上可实现梁膜结构。本文针对硅基微热板气体传感器及阵列存在的工艺复杂性、膜基兼容性差、热应力失配等失稳行为,提出了采用氮化铝陶瓷基MEMS工艺制备陶瓷微热板传感器阵列的技术。解决陶瓷微热板传感器阵列的热干扰问题,及陶瓷基MEMS工艺的光刻剥离技术和刻蚀技术,实现了基于Al N陶瓷微热板气体传感器阵列的制备,及对几种有毒有害气体的检测,并对检测数据进行了气敏特性分析和气敏机理的探讨。主要研究内容如下:1.陶瓷微热板传感器阵列的热结构尺度设计。根据陶瓷微热板热结构尺度效应和陶瓷湿法定向刻蚀难实现的特点,提出可适用于激光微加工刻蚀工艺的热隔离设计,通过热隔离梯形通孔结构实现热传导损结构几何因子的减小,降低了热损耗。并给出了热结构稳态和瞬态特性及热应力耦合分析,利用ANSYS有限元法进行了陶瓷微热板的热结构和热应力仿真计算,确定了设计合理性及可行性。2.In-Nb复合氧化物半导体敏感材料的合成及特性研究。为解决氯气等强氧化性气体的高浓度、宽量程、低温检测要求。研究并制备了Sn O2和InNb复合半导体纳米氧化物作为敏感材料,并对其进行了XRD和SEM表征分析。通过不同温度下纳米结构变化规律特征,给出了气敏特性和电导特性的影响机理分析。3.氮化铝陶瓷微热板传感器阵列的制备工艺技术研究。为改进陶瓷衬底表面复杂形貌金属成型工艺难实现,及陶瓷基底难加工特点,提出了柔性机械剥离工艺方法和激光微加工工艺方法相结合的工艺制备技术。通过柔性机械剥离工艺法,提高传统光刻剥离工艺的剥离效果,相对反转胶剥离工艺法,简化了剥离工艺步骤,降低了制备工艺成本。4.氮化铝陶瓷微热板传感器阵列热失稳特性及气敏特性测试分析。根据阵列单元之间的热耦合特性,提出了阵列单元的四种热干扰模式,并进行了四种模式下的热干扰测试分析。对热隔离前后的热响应特性进行对比分析,给出了温度调至下存在的三种热响应机制。针对Cl2、NO2、SO2、CO四种典型有毒有害气体进行了气敏响应特性和灵敏度特性分析,得到了InNb复合氧化物半导体气体传感器阵列,对氧化性气体Cl2、NO2能实现高浓度、宽量程的理想检测要求。5.针对所制备的氮化铝陶瓷微热板传感器阵列,设计并实现了基于ARM Cortex-M3微处理器的数据采集检测系统。并搭建了可用于有毒有害气体检测的密闭测试系统平台,实现了所制备的陶瓷微热板传感器阵列实时在线信号检测要求。经测试结果分析,验证了所制备的陶瓷微热板气体传感器阵列设计的合理性及关键工艺技术的可行性,为陶瓷微热板传感器阵列微系统技术的深入研究和发展奠定了基础。
[Abstract]:At present, China is the world's largest energy and chemical raw materials production and consumption country. The production and transportation of chemical raw materials and energy security situation is very serious, the energy and chemical field of hazardous chemicals leakage explosion accidents, toxic and harmful gases in industrial and agricultural emissions lead to air pollution have become increasingly prominent, fast and effective testing means to continuously improve among them, detection of toxic and harmful gases of hazardous chemicals in urgent. The traditional detection sensor has large volume, high power consumption, the lack of integration and other defects, has been unable to meet the needs of modern intelligent network security detection. Using MEMS sensor array technology can meet the miniaturization of integrated gas sensor technical requirements, bulk silicon etching of silicon.MEMS technology of low power detection is mainly applicable to the micro mechanical quantity sensor in silicon based micro hotplate gas sensor array and storage In a variety of film forming process is complex, poor compatibility, thermal mismatch and other defects. The ceramic hotplate and sensor array technology has the advantages of simple process, adhesion and heat, the advantages of good, is a good combination of nanomaterials. Especially excellent mechanical properties, dielectric coefficient is high, the structure of can realize beam membrane structure. According to the process complexity of silicon based micro hotplate gas sensor array and the membrane, poor compatibility, thermal stress mismatch instability behavior, put forward the preparation of ceramic hotplate sensor array using aluminum nitride Tao Ciji MEMS process technology. To solve the thermal interference problem of ceramic hotplate sensor array MEMS process and ceramic matrix, lithography stripping technology and etching technology, realizes the Al N micro hotplate gas sensor array based on the preparation, and detection of several toxic and harmful gases, and the test data The analysis and the sensitive mechanism of gas sensing characteristics are discussed. The main contents are as follows: the thermal structure of 1. scale ceramic hotplate sensor array design. According to the characteristics of ceramic hotplate thermal structure scale and ceramic wet etching orientation difficult to achieve, the applicable thermal isolation design in laser micromachining etching process, the thermal insulation ladder through hole structure can reduce the heat loss of geometric structure factor, reduce the heat loss. And gives the stress coupling analysis of thermal structure of steady and transient characteristics of heat and the thermal structure and ceramic hotplate stress calculation simulation by ANSYS finite element method, the synthesis and characterization of the design rationality and feasibility.2.In-Nb composite oxide semiconductor sensitive material. The high concentration solution, chlorine and other strong oxidizing gases and wide range, low temperature detection requirements. The research and preparation of Sn O2 and InNb composite Nano semiconductor oxide as a sensitive material, and has carried on the analysis of XRD and SEM respectively. Through the nano structure change under different temperature characteristics, analysis of.3. aluminum nitride ceramic hotplate sensor array preparation technology research on the impact mechanism gives the gas sensing properties and electrical conductivity. In order to improve the surface morphology of metal forming complex ceramic substrate the process is difficult to achieve, and the ceramic base of hard machining characteristics, put forward the process of flexible mechanical stripping process and laser micro processing technology combining method of preparation technology. Through the flexible mechanical stripping process, improve the traditional photolithography process stripping stripping effect, relative inversion stripping process, simplify the stripping process steps, reduce the preparation of test sensitivity analysis of losing stability and gas production cost of.4. aluminum nitride ceramic hotplate thermal sensor array. According to the thermal coupling between array elements together The characteristics, puts forward four kinds of thermal interference patterns of the array elements, and analyzed the thermal interference test under the four models. The comparative analysis of the response characteristics of thermal isolation before and after heat, three kinds of thermal response mechanism is given under the temperature to exist. For Cl2, NO2, SO2, CO four kinds of typical toxic gas analysis characteristics and sensitivity characteristics of gas sensing response, InNb composite oxide semiconductor gas sensor array is obtained, the oxidizing gas Cl2, NO2 can achieve high concentration, wide range of ideal detection requirements.5. for aluminum nitride ceramic hotplate sensor array preparation, design and implementation of data acquisition and detection system of ARM Cortex-M3 based on the microprocessor. And set up can be used for the detection of toxic and harmful gas sealed test system platform, realizes the real-time signal detection of ceramic hotplate sensor array prepared by measuring the requirements. The results show that the design of the ceramic micro hotplate gas sensor array is reasonable and the feasibility of the key process technology is feasible, which lays the foundation for further research and development of ceramic micro hotplate sensor array micro system technology.
【学位授予单位】:哈尔滨理工大学
【学位级别】:博士
【学位授予年份】:2015
【分类号】:TP212
【参考文献】
相关期刊论文 前10条
1 迟霄;刘唱白;张金宝;刘丽;李海英;何越;薄小庆;刘丽丽;;Toluene-sensing properties of In_2O_3 nanotubes synthesized by electrospinning[J];Journal of Semiconductors;2014年06期
2 蒋庄德;田边;赵玉龙;赵立波;;特种微机电系统压力传感器[J];机械工程学报;2013年06期
3 张洪泉;乔英杰;范茂军;;基于γ-Al_2O_3膜微加工煤油传感器研究[J];传感器与微系统;2012年03期
4 汤晓君;李玉军;朱凌建;丁晖;刘君华;;具有相同分子基团的多组分气体现场在线光谱分析[J];光谱学与光谱分析;2011年11期
5 薛严冰;唐祯安;;基于陶瓷微热板的高温气体传感器研究[J];光电子.激光;2011年07期
6 黄占喜;吴亚明;李四华;;基于多掩膜光刻工艺的MEMS体硅加工[J];功能材料与器件学报;2011年03期
7 荣皓;赵钢;褚家如;;用于热机械微纳加工的掺Al多晶硅加热器[J];光学精密工程;2011年01期
8 何大伟;程新红;王中健;徐大朋;宋朝瑞;俞跃辉;;反转胶lift-Off工艺制备堆栈电感[J];功能材料与器件学报;2010年02期
9 金翠云;崔瑶;王颖;;电子鼻及其在各领域的最新研究进展[J];传感器世界;2010年03期
10 陈德鹅;吴志明;李伟;王军;袁凯;蒋亚东;;图形反转工艺用于金属层剥离的研究[J];半导体技术;2009年06期
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