荧光玻璃制备及其LED封装应用研究
发布时间:2018-10-26 18:22
【摘要】:大功率发光二级管(LED)作为新一代的绿色光源,已广泛地应用于各种照明领域。目前大多数白光LED器件采用的是在LED芯片上涂覆荧光粉和环氧/硅胶混合物的封装形式,由于环氧/硅胶等有机聚合物的耐热性和抗老化性能较差,采用了这类有机聚合物的白光LED难以用于高功率器件中。为了提高LED器件的光学性能及可靠性,本文提出将丝网印刷和低温共烧技术相结合的方法来制备荧光玻璃,并将得到的荧光玻璃用于大功率白光LED封装。为了分析这种荧光玻璃在LED封装中的应用性能,本文从LED封装的出光效率、颜色品质和热可靠性三个方面开展研究。具体研究内容包括:1)通过丝网印刷和低温共烧的方法制备荧光玻璃。研究了荧光粉掺量和烧结工艺温度对荧光玻璃发光性能的影响,实验分析得到荧光玻璃的最佳烧结温度为550℃~600℃。将荧光玻璃封装在LED模块中,研究了荧光粉掺量、荧光玻璃放置方向和玻璃基板厚度对白光LED性能的影响。结果表明,玻璃粉与荧光粉的重量比为8.3:1.7时,白光LED的综合光学性能最优。将荧光玻璃层面朝芯片方向放置、减小玻璃基板厚度,均有利于提高白光LED的光效。2)为了提高荧光玻璃LED封装的出光效率,提出一种在荧光玻璃表面制作粗化结构的方法。实验中制备了三种粗化结构,分别是周期分布的微米结构、随机分布的微米结构和随机分布的纳米结构。探究了不同粗化结构对LED封装光学性能的影响,揭示了粗化结构提高LED出光效率的内在机理。实验结果显示,采用周期分布的微米结构能够将LED出光效率提高9%以上,而随机分布的微米结构能够使LED半光强角由120.80扩大到129.10,随机分布的纳米结构能够将玻璃透光率提高5%。3)为了提高荧光玻璃LED封装的颜色品质,提出一种新型的多层圆锥形荧光玻璃结构。光学模拟和实验结果表明,采用多次印刷堆叠法制作的三层圆锥形荧光玻璃能够显著改善LED的颜色均匀性。采用黄粉和红粉混合共烧的方法制备了高显色指数的荧光玻璃,通过调节黄粉和红粉比例得到了从冷白光到暖白光不同色温的白光LED。制备了红黄分离的双层型荧光玻璃和半圆形、同心圆形两种图形化结构的荧光玻璃。实验结果表明,采用这些特殊的结构形式能够降低山于红粉和黄粉光谱重叠而造成的光线重吸收损耗。4)为了分析荧光玻璃的热可靠性,建立三维单元体模型计算了荧光玻璃复合材料的等效热导率,并通过热线法进行实验验证。结果表明,模拟计算值与实验测量值的偏差在4%以内。综合运用数值模拟和实验测量的手段研究了荧光材料热导率对LED封装光学性能的影响,分析结果表明荧光玻璃温度低于荧光粉胶温度,荧光玻璃LED封装的光通量饱和点更高,色温更稳定。在不同温度下分别对荧光粉胶和荧光玻璃进行老化试验,发现荧光玻璃的光学性能在热老化过程中能够持续保持稳定。
[Abstract]:As a new generation of green light source, high power light-emitting diode (LED) has been widely used in various lighting fields. At present, most white LED devices are encapsulated with phosphors coated on LED chips and epoxy / silica gel mixtures, because of the poor heat resistance and aging resistance of organic polymers such as epoxy / silica gel. White LED with this kind of organic polymer is difficult to be used in high power devices. In order to improve the optical properties and reliability of LED devices, a method of combining screen printing with low temperature co-firing technology is proposed to prepare fluorescent glass. The fluorescent glass is used in high-power white light LED packaging. In order to analyze the application performance of the fluorescent glass in LED packaging, the light efficiency, color quality and thermal reliability of LED packaging are studied in this paper. The main contents are as follows: 1) fluorescent glass was prepared by screen printing and low temperature co-firing. The effects of phosphor content and sintering temperature on luminescent properties of fluorescent glass were studied. The optimum sintering temperature of fluorescent glass was obtained from 550 鈩,
本文编号:2296578
[Abstract]:As a new generation of green light source, high power light-emitting diode (LED) has been widely used in various lighting fields. At present, most white LED devices are encapsulated with phosphors coated on LED chips and epoxy / silica gel mixtures, because of the poor heat resistance and aging resistance of organic polymers such as epoxy / silica gel. White LED with this kind of organic polymer is difficult to be used in high power devices. In order to improve the optical properties and reliability of LED devices, a method of combining screen printing with low temperature co-firing technology is proposed to prepare fluorescent glass. The fluorescent glass is used in high-power white light LED packaging. In order to analyze the application performance of the fluorescent glass in LED packaging, the light efficiency, color quality and thermal reliability of LED packaging are studied in this paper. The main contents are as follows: 1) fluorescent glass was prepared by screen printing and low temperature co-firing. The effects of phosphor content and sintering temperature on luminescent properties of fluorescent glass were studied. The optimum sintering temperature of fluorescent glass was obtained from 550 鈩,
本文编号:2296578
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