LED封装有机硅材料的制备与性能研究

发布时间：2018-10-13 08:20

【摘要】：发光二极管（LED）与传统光源相比具有许多优点，例如高效节能、环保、寿命长，它已成为新一代照明光源，是21世纪最具社会意义和经济价值的高新技术之一。LED制造技术的完善、亮度和功率的不断提高，对LED封装材料的性能提出了更高的要求。国内市场性能优良的LED封装材料依赖于进口，阻碍了具有自主知识产权的半导体照明计划的顺利实施。基于这一现状，，本文采用加成固化和环氧苯酐固化法制备了两种LED封装有机硅材料，并对其性能进行了表征。加成型液体硅橡胶以其优异的耐热、耐老化及抗黄变等性能使之成为较为理想的LED封装材料。为了考察交联剂种类、含氢量、乙烯基硅油和Si-H:Si-Vi值等各因素对加成型液体硅橡胶力学性能、透光性、粘结性的影响，本文通过配方设计，采用硅氢加成法分别制备了低折光指数（未加填料）、低折光指数（加填料）、高折光指数（低乙烯基含量硅树脂）和高折光指数（高乙烯基含量硅树脂）加成型液体硅橡胶，并对其进行了力学性能、透光性、粘结性表征。由测试结果得出了交联剂种类、含氢量、乙烯基硅油和Si-H:Si-Vi值等因素对加成型液体硅橡胶力学性能、透光性、粘结性的影响规律，该研究具有一定的理论价值和应用价值。目前LED封装领域使用最多的是环氧树脂和有机硅材料，为了制备兼具两者优点的有机硅改性环氧树脂，本文以γ-(2,3环氧丙氧)丙基三甲氧基硅烷（KH560）和二苯基硅二醇(DPSD)为原料通过缩聚反应制备出带有苯基和环氧基团的高折光指数有机硅改性环氧树脂。研究了催化剂、反应温度、反应时间、反应物的摩尔比对有机硅改性环氧树脂性能的影响，确定出最佳反应条件，并通过傅里叶变换红外光谱（FT-IR）和核磁共振（1H NMR）对其进行了结构表征。与甲基六氢苯酐固化后得到透明的有机硅封装材料，并对固化后的有机硅封装材料进行了透光性、粘结性、耐热性能、力学性能的表征。结果表明：有机硅封装材料具有较高的折光指数（1.547）、较高的透光率（95%）、优异的粘结性、良好的耐热性以及力学性能，可以用于LED封装领域。
[Abstract]:Light emitting diode (LED) has many advantages compared with traditional light source, such as high efficiency, energy saving, environmental protection and long life. It has become a new generation of lighting light source and is one of the most social and economic high and new technologies in the 21st century. With the improvement of brightness and power, the performance of LED packaging materials is required higher. LED packaging materials with excellent performance in domestic market depend on import, which hinders the implementation of semiconductor lighting program with independent intellectual property rights. Based on this situation, two kinds of LED encapsulated silicone materials were prepared by additive curing and epoxy phthalic anhydride curing, and their properties were characterized. Additive liquid silicone rubber is an ideal LED packaging material due to its excellent heat resistance, aging resistance and yellowing resistance. In order to investigate the effects of various factors, such as the type of crosslinking agent, hydrogen content, vinyl silicone oil and Si-H:Si-Vi value, on the mechanical properties, light transmittance and adhesion of additive liquid silicone rubber, the formula was designed in this paper. The low refractive index (no filler), low refractive index (adding filler), high refractive index (low vinyl content silicone resin) and high refractive index (high vinyl content silicone resin) were prepared by hydrosilylation addition method. The mechanical properties, light transmittance and bond properties were characterized. The effects of crosslinking agent, hydrogen content, vinyl silicone oil and Si-H:Si-Vi value on mechanical properties, light transmittance and adhesion of additive liquid silicone rubber were obtained. This study has certain theoretical value and application value. At present, epoxy resin and silicone materials are the most widely used in the field of LED packaging. In order to prepare silicone modified epoxy resin with both advantages, In this paper, high refractive index silicone modified epoxy resin with phenyl and epoxy groups was prepared by condensation reaction of 纬-(2o 3 epoxy propyl) propyl trimethoxy silane (KH560) and diphenyl silyl diol (DPSD). The effects of catalyst, reaction temperature, reaction time and molar ratio of reactants on the properties of silicone modified epoxy resin were studied. Their structures were characterized by Fourier transform infrared spectroscopy (FT-IR) and nuclear magnetic resonance (1H NMR). Transparent silicone packaging materials were obtained after curing with methylhexahydrophthalic anhydride. The transparency, adhesion, heat resistance and mechanical properties of the cured silicone packaging materials were characterized. The results show that the silicone packaging materials have high refractive index (1.547), high transmittance (95%), excellent adhesion, good heat resistance and mechanical properties, and can be used in the field of LED packaging.
【学位授予单位】：天津大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TN312.8;O627.41

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