超声振动对单晶硅锯切比能的影响

发布时间：2018-01-26 16:55

本文关键词： 超声振动硬脆材料金刚石薄锯片单晶硅锯切比能　出处：《材料科学与工艺》2017年01期 　论文类型：期刊论文

【摘要】：超声振动能很好地改善硬脆性材料的加工性能,为了探索超声振动锯切比能对单晶硅的影响,本文采用薄金刚石锯片,在有无超声振动的条件下对单晶硅进行锯切实验.实验结果表明:超声振动使锯切材料过程中的比能大幅度降低;2种锯切方式下锯切比能都随着单颗磨粒最大锯切厚度的增大而降低,但普通锯切方式下锯切比能呈幂指数递减趋势,而在超声振动的作用下比能变化趋势转变为良好的线性递减;并且单晶硅材料的去除方式由普通锯切中塑性去除为主导转变为脆性断裂去除,其破碎方式属于微破碎,趋于粉末状破碎,由此在不会对工件表面产生严重损伤的同时使材料去除所消耗的能量得到了有效降低.同时,超声振动使得锯片上的磨粒对单晶硅表面的高速冲击作用,使单晶硅产生大量微裂纹,对单晶硅的微小剥离起到很大作用.因此,超声振动在单晶硅材料的加工中有着很大的发展前景.
[Abstract]:Ultrasonic vibration can improve the processing performance of hard brittle materials. In order to explore the effect of ultrasonic vibration sawing specific energy on monocrystalline silicon thin diamond saw blade is used in this paper. The experimental results show that the specific energy in the sawing process is greatly reduced under the condition of ultrasonic vibration or not. The sawing specific energy decreases with the increase of the maximum sawing thickness of a single abrasive, but the sawing specific energy decreases exponentially under the common sawing mode. Under the action of ultrasonic vibration, the change trend of specific energy changed into a good linear decline. And the removal mode of monocrystalline silicon is changed from plastic removal to brittle fracture removal, which belongs to micro-crushing and tends to powder crushing. Therefore, the energy consumed by material removal can be effectively reduced while not causing serious damage to the surface of the workpiece. Meanwhile, ultrasonic vibration makes the abrasive particles on the saw blade impact on the surface of monocrystalline silicon at high speed. A large number of microcracks are produced in monocrystalline silicon, which plays an important role in the microdelamination of monocrystalline silicon. Therefore, ultrasonic vibration has a great development prospect in the processing of monocrystalline silicon materials.
【作者单位】：华侨大学机电及自动化学院;
【基金】：国家自然科学基金(51275181) 华侨大学研究生科研创新能力培育计划资助项目(1511303004)
【分类号】：TN304.12;TB559
【正文快照】： 单晶硅作为一种重要的新型半导体材料,在各个领域尤其是光伏发电与电子信息领域中得到了广泛应用,在太阳能发电和集成电路中起到举足轻重的作用[1-2].单晶硅是一种硬脆材料,具有硬度高、脆性大等特点,材料切削加工性能差,零件加工要求高,因此在加工过程中受到了一定的限制,难

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