有尾排气式真空封装内部放气特性分析

发布时间：2018-04-21 04:03

本文选题：真空封装 + 内部放气　；参考：《真空科学与技术学报》2016年02期

【摘要】：以一种有尾排气式真空封装器件为对象,从释放气体组分和放气量两方面对封装体内部放气特性进行了分析,旨在为器件的高真空度设计、提高器件寿命提供依据。首先,通过残余气体分析得到了各封装体内部的气体成分,推理出各构件所释放气体的具体组分;其次,通过真空电阻丝标定方法得到了各封装体内的压强变化,分析出各构件的放气量。研究结果表明,封装体内部的气体主要有:N_2,O_2,Ar,CO_2,H_2O,H_2,碳氢化合物,甲醇等,其中管壳是最大的气源,主要释放气体为H_2、H_2O;其次为银浆,主要释放气体为CO_2、N_2;最后为半导体制冷器,主要释放气体为H_2O、CO_2、N_2。
[Abstract]:In this paper, a tail-exhaust vacuum packaging device is used to analyze the gas release characteristics of the package from the aspects of gas release component and gas discharge rate, in order to provide the basis for the high vacuum design of the device and the improvement of the device life. Firstly, the gas components in each package are obtained by residual gas analysis, and the specific components of the gas released by each component are deduced. Secondly, the pressure changes in each package are obtained by the method of vacuum resistance wire calibration. The amount of gas released from each component is analyzed. The results show that the main gases in the package are: 1 / N2S / O / T / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / C / The main emission gas is H _ 2O _ O _ 2C _ 2 / N _ 2.
【作者单位】：西北工业大学空天微纳系统教育部重点实验室;西北工业大学陕西省微/纳米系统重点实验室;
【分类号】：TB754

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