紫外纳秒激光直写铜膜微结构的研究

发布时间：2018-04-26 05:15

本文选题：激光 + 铜膜　；参考：《天津大学》2014年硕士论文

【摘要】：金属薄膜在MEMS设备制造,航空航天,半导体加工等众多领域均有广泛的应用。在金属薄膜上制作微结构的方法很多,本文针对使用激光直写技术在铜薄膜上制作微结构进行了理论分析和实验研究。本文针对实际加工的需求,提出了不同的实验方法,论文的主要工作包括以下几个部分:1.从理论角度分析了激光与材料相互作用的机理,描述了金属对激光的反射和吸收,并利用双温模型描述了热量在材料中的传播过程。通过激光的能量密度公式推导出脉冲能量的对数与烧蚀点直径的平方呈线性关系。通过累积模型提出运动的光斑烧蚀铜膜的模型。2.以中心波长为355 nm的固态激光器为核心设计并搭建了一套紫外纳秒脉冲激光加工系统。系统运动控制核心为PMAC运动控制卡,PMAC通过扩展卡将输出信号发送给位移台的驱动电机,进而控制位移台的运动方式。上位机软件通过通讯接口控制激光器的参数并向PMAC发送指令,通过对激光器和位移台的协调控制实现对样品的加工。3.本文使用搭建的紫外纳秒脉冲激光加工系统进行了脉冲激光烧蚀铜膜的实验,实验使用的铜膜厚度为200 nm。实验主要分为两部分:单脉冲烧蚀铜膜和激光在铜膜上直写直线结构。通过实验得到激光脉冲能量和烧蚀点直径的关系,以及使用本系统加工金属薄膜时,能够获得较好加工效果所需要的参数。此外还将铜膜放置在焦平面外进行烧蚀实验。实验发现将铜膜放置在焦平面外一定距离时,加工效果较为理想,这种加工方式适合加工尺寸较大的微结构。
[Abstract]:Metal thin films are widely used in many fields, such as MEMS equipment manufacturing, aerospace, semiconductor processing and so on. There are many methods to fabricate microstructures on metal thin films. In this paper, the theoretical analysis and experimental study on the fabrication of microstructures on copper thin films by laser direct writing have been carried out. According to the requirement of practical processing, different experimental methods are put forward in this paper. The main work of this paper includes the following parts: 1: 1. The mechanism of laser interaction with materials is analyzed theoretically, the reflection and absorption of metal to laser are described, and the heat propagation process in materials is described by double temperature model. A linear relationship between the logarithm of pulse energy and the square of ablation point diameter is derived by the formula of laser energy density. Based on the cumulative model, the model of moving spot ablating copper film is proposed. A UV nanosecond pulse laser processing system is designed and built based on 355nm solid-state laser with center wavelength of 355nm. The motion control core of the system is the PMAC motion control card, which sends the output signal to the driving motor of the displacement table through the extension card, and then controls the motion mode of the displacement table. The upper computer software controls the parameters of the laser and sends instructions to the PMAC through the communication interface. Through the coordinated control of the laser and the displacement table, the processing of the sample is realized. 3. In this paper, the experiment of pulsed laser ablation of copper film has been carried out by using the UV nanosecond pulsed laser processing system. The thickness of the copper film used in the experiment is 200 nm. The experiment is mainly divided into two parts: monopulse ablating copper film and laser direct writing straight line structure on copper film. The relationship between laser pulse energy and ablation point diameter is obtained by experiments, and the parameters needed for better machining effect can be obtained when the system is used to process metal films. In addition, the copper film was placed outside the focal plane for ablation experiments. It is found that when the copper film is placed at a certain distance outside the focal plane, the processing effect is ideal, and this kind of processing method is suitable for machining the microstructures with larger size.
【学位授予单位】：天津大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TN249;TB383.2;TG146.11

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