聚酰亚胺杂化薄膜热降解动力学研究

发布时间：2018-05-24 06:54

  本文选题：聚酰亚胺 + 热重分析　； 参考：《哈尔滨理工大学》2014年硕士论文

【摘要】：随着现代科技的迅猛发展，对材料的性能提出了更高的要求。由于聚酰亚胺具有耐高温等特种功能，一直被广泛应用到航空与微电子领域。为进一步提高聚酰亚胺电、热、力学性能，将聚合物进行无机纳米粒子掺杂从而进一步提高了聚酰亚胺薄膜的耐热性能，使其热老化寿命在一定温度范围内有所提高。现在杂化聚酰亚胺薄膜已经成为高分子材料中耐热性能最好的品种之一。吸引了更多的学者对其进行更加深入的研究。 随着人们对复合材料应用的研究，发现在材料中加入纳米粒子可以使材料的各种性能得到改善，纳米粒子因其具有较高的比表面积而受到越来越广泛地应用。加入纳米粒子提高了体系的热性能，使经由纳米粒子改性的材料在综合性能上优于原材料，具有突出的综合性能，进而满足了各领域的需求。复合材料因纳米粒子的发现而有了新的研究方向。 本文采用热重分析法对自制的纳米Al_2O_3杂化PI薄膜的热稳定性进行了分析，通过热重分析方法研究杂化聚酰亚胺的热老化寿命。采用Kissinger法求得PI薄膜在空气和氮气气氛下的化学反应活化能E，同时计算出相应的碰撞系数A，计算出纳米Al_2O_3掺杂含量为0wt%、4wt%、8wt%、12wt%、16wt%、20wt%、24wt%的杂化聚酰亚胺薄膜的热老化寿命温度。在掺杂量12wt%时，在空气和氮气中长期使用上限温度最大值分别为318℃、384℃。
[Abstract]:With the rapid development of modern science and technology, higher requirements for the properties of materials are put forward. Polyimide has been widely used in aviation and microelectronics due to its high temperature resistance and other special functions. In order to further improve the electrical, thermal and mechanical properties of polyimide, the polymer was doped with inorganic nanoparticles to further improve the heat resistance of polyimide film, and the thermal aging life of polyimide film was improved in a certain temperature range. Hybrid polyimide films have become one of the best heat resistant materials. Attracted more scholars to carry out more in-depth research. With the research of composite materials, it is found that the properties of composite materials can be improved by the addition of nano-particles, and the nano-particles are more and more widely used because of their high specific surface area. The thermal properties of the system were improved with the addition of nano-particles, and the composite properties of the materials modified by nano-particles were superior to those of the raw materials, thus satisfying the needs of various fields. Composite materials have a new research direction because of the discovery of nanoparticles. The thermal stability of self-made Al_2O_3 hybrid Pi films was analyzed by thermogravimetric analysis. The thermal aging life of hybrid polyimides was studied by thermogravimetric analysis. The activation energy of chemical reaction of Pi film in air and nitrogen atmosphere was obtained by Kissinger method, and the corresponding collision coefficient A was calculated, and the thermal aging life temperature of hybrid polyimide film was calculated when the doping content of nanometer Al_2O_3 was 0 wtand 4 wtand 8 wtand 12 wtand 16 wtand 20wtand 24wt% respectively. When the doping amount is 12wt%, the upper limit temperature of air and nitrogen is 318 鈩，

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