电子束蒸发法沉积金属聚合物基复合薄膜成膜机理及其性能研究

发布时间：2018-06-20 05:31

  本文选题：电子束蒸发法 + Cu/PE薄膜　； 参考：《南京理工大学》2017年硕士论文

【摘要】：以铜、银等纳米材料为代表的抗菌材料以其高效的抗菌性能,在生活中有广泛的应用潜力,也成为当代科研的热点。与此同时,具有防污,自清洁的疏水材料也是目前人们追求的潮流,因此本文基于聚合物的疏水特性,再结合纳米银、铜颗粒的高效抗菌性能,采用低功率电子束蒸发法(EBD),制备既具有疏水性能,又具有高效抗菌性能的多功能复合膜材料。主要研究内容如下:采用低功率电子束蒸发法,分别选用乙酸铜粉末、聚乙烯粉末为原材料,使用单晶硅片、石英片、氯化钠片为基底,制备掺铜聚合物基复合薄膜。氮气气氛下,在300-500℃范围内,通过管式炉对初始态薄膜样品进行热处理,通过Tg观察了复合薄膜结构成分变化,XPS分析复合薄膜的元素组成、FTIR和UV-vis分析复合薄膜表面的内部成分,TEM和SEM观察了薄膜的表面形貌,所制备的的复合薄膜为铜纳米颗粒均匀分布于聚合物基膜中的两相结构。复合薄膜具有一定的疏水性能,同时对大肠杆菌有着比较明显的抗菌效果。采用低功率电子束蒸发法,以硝酸银粉末为银源,分别以聚甲基丙烯酸甲酯、聚乙烯、聚乳酸为聚合物基体材料,采用上述相同的制备工艺参数,制备银掺杂不同聚合物基复合薄膜。在氮气气氛下,75-225℃范围内,通过管式炉对初始态薄膜样品进行热处理,得到了银纳米颗粒均匀分布于不同聚合物基膜中的两相结构。经过UV-vis、FTIR、XPS等测试手段研究薄膜成分和结构,探究电子束蒸发法制备金属聚合物基复合薄膜的成膜机理。
[Abstract]:The antibacterial materials, such as copper, silver and other nanomaterials, with their high antibacterial properties, have wide application potential in daily life, and have also become the focus of contemporary scientific research. At the same time, anti-fouling, self-cleaning hydrophobic materials are also the current trend, so this paper based on the hydrophobic properties of polymers, and combined with nano-silver, copper particles of high efficiency antibacterial properties, Low power electron beam evaporation (EBD) method was used to prepare multifunctional composite membrane materials with both hydrophobic and antibacterial properties. The main contents are as follows: copper doped polymer based composite films were prepared by low power electron beam evaporation, copper acetate powder, polyethylene powder as raw material, single crystal silicon wafer, quartz wafer and sodium chloride as substrate. In nitrogen atmosphere, the initial thin film samples were treated by tube furnace in the range of 300-500 鈩，

本文编号：2043151