利用正交试验方法探讨Cu-Sn粉末的烧结性能

发布时间：2018-07-05 05:52

  本文选题：Cu-Sn粉末 + 正交试验　； 参考：《粉末冶金工业》2017年02期

【摘要】：选用雾化法制备的低熔点高Sn含量的Cu-Sn50合金粉末进行热压烧结试验,利用正交试验方法研究烧结温度、保温时间和保压压力3个烧结因素的组合作用对粉末烧结性能的影响。通过对正交试验数据的极差分析、试验样品的SEM形貌和金相组织观察分析等,测得试样烧结性能的变化情况及最优试验方案。结果表明:Cu-Sn50合金粉末在烧结温度440℃、保温180 s、压力10 MPa工艺参数下各项性能较好,可作为最佳试验方案。
[Abstract]:Cu-Sn50 alloy powder with low melting point and high Sn content was prepared by atomization method. The effects of sintering temperature, holding time and holding pressure on the sintering properties of Cu-Sn50 alloy powder were studied by orthogonal test. Through the range analysis of the orthogonal test data, SEM morphology and metallographic observation and analysis of the sample, the change of the sintered property of the sample and the optimum test scheme were obtained. The results show that the properties of the alloy powder are better under sintering temperature 440 鈩，

本文编号：2099190