考虑多失效机理耦合的电子产品寿命预测方法研究

发布时间：2019-04-21 14:05

【摘要】：电子产品在运输、服役过程中受到复杂环境的综合影响,如温度循环、随机振动、冲击、电磁、湿度等综合应力共同作用加速产品失效。为确保设计、生产的电子产品满足既定的使用寿命要求,研究电子产品考虑多失效模式耦合下的寿命预测具有非常重要的意义,能够为电子产品的寿命预测和试验提供技术支撑。本文主要分析了电子产品的失效物理理论,重点讨论了电子产品的典型失效模式与失效机理,以及电子产品在温度循环、随机振动循环、电应力单独作用下的寿命预测模型。在失效物理的寿命预测的基本假设和建模方法的基础上,给出了多失效机理耦合下的寿命预测流程及方法。研究了热疲劳失效、振动疲劳失效两种失效模式耦合作用下的失效机理,并采用线性累积损伤方法和渐进损伤叠加方法两种方法,对温度循环与随机振动循环耦合的电子产品失效寿命进行预测。对球栅阵列封装的BGA(Ball Grid Array)器件用作分析,通过建立有限元模型进行焊点的应力应变分析,然后利用本文提出的流程及方法预测该产品在综合应力作用下的失效寿命。将仿真结果与Haiyu Qi完成的试验结果进行对比,验证本文提出的方法的可行性和准确性。综上所述,本文从失效物理的角度分析了其失效的原因,通过理论建模、仿真分析和试验对比,研究了考虑多失效机理耦合下的电子产品寿命预测方法。本文的研究成果将对复杂环境中,多失效模式共同作用导致电子产品失效寿命的预测研究应用具有借鉴意义。
[Abstract]:In the course of transportation and service, electronic products are affected by complex environment, such as temperature cycle, random vibration, shock, electromagnetic, humidity and so on. In order to ensure the design of electronic products to meet the established service life requirements, it is of great significance to study the life prediction of electronic products under the coupling of multiple failure modes. Can provide technical support for life prediction and testing of electronic products. In this paper, the failure physics theory of electronic products is mainly analyzed, and the typical failure modes and failure mechanisms of electronic products are emphatically discussed, and the life prediction models of electronic products under the action of temperature cycle, random vibration cycle and electrical stress alone are also discussed. Based on the basic assumptions and modeling methods of life prediction in failure physics, the process and method of life prediction under the coupling of multi-failure mechanism are presented. The failure mechanism of thermal fatigue failure and vibration fatigue failure under the coupling of two failure modes is studied. The linear cumulative damage method and the progressive damage superposition method are adopted. The failure life of electronic products coupled with temperature cycle and random vibration cycle is predicted. The BGA (Ball Grid Array) device packaged by spherical grid array is analyzed. The stress-strain analysis of solder joint is carried out by establishing a finite element model, and then the failure life of the product under the action of comprehensive stress is predicted by the flow and method proposed in this paper. The simulation results are compared with the experimental results completed by Haiyu Qi to verify the feasibility and accuracy of the proposed method. In conclusion, the reason of failure is analyzed from the point of view of failure physics. Through theoretical modeling, simulation analysis and experimental comparison, the method of life prediction for electronic products considering the coupling of multi-failure mechanism is studied in this paper. The research results of this paper will be useful for the prediction and application of failure life of electronic products caused by multiple failure modes in complex environment.
【学位授予单位】：国防科学技术大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TB114.3

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