模组屏物流包装系统设计

发布时间：2018-01-16 01:22

本文关键词：模组屏物流包装系统设计　出处：《包装工程》2017年01期 　论文类型：期刊论文

【摘要】：目的研究模组屏物流包装形式、结构及包装工艺操作性。方法针对模组屏自身特点,对其原卧式包装形式进行改进,设计模组屏立式包装。利用三维建模软件建立缓冲衬垫和模组屏模型后,将两者进行装配。将包装三维模型导入仿真软件Ansys Workbench中,设置材料属性后,对其进行有限元网格划分,再对各物理性能进行模拟仿真分析。结果对模组屏立式包装提出了通用化包装设计方案,实现了直下式模组屏立式包装。结论采用通用化缓冲衬垫包装的模组屏在跌落过程中受到的加速度最大为610.58 m/s2,比原包装减小了26.8%,比每片同尺寸卧式包装的成本降低了26.57%,可通用5种原型机,大幅度提高了包装效率,降低了包装成本。
[Abstract]:Objective to study the logistics packaging form, structure and operation of packaging technology of module panel. Methods according to the characteristics of module panel, the original horizontal packaging form was improved. The model panel vertical packaging was designed. The cushioning cushion and the module screen model were built by using 3D modeling software, and the two models were assembled. The package 3D model was imported into the simulation software Ansys Workbench. After setting the properties of the materials, the finite element mesh is used to divide them, and then the physical properties are simulated and analyzed. The results show that the universal package design scheme is put forward for the vertical packaging of the module panel. The vertical packaging of straight down module panel was realized. Conclusion the maximum acceleration of the module panel with universal cushioning pad packaging is 610.58 m / s ~ (2) during the drop process. Compared with the original packaging, the cost of the horizontal packaging is 26.57 lower than that of the original packaging. The general use of five prototypes can greatly improve the packaging efficiency and reduce the packaging costs.
【作者单位】：青岛科技大学;
【分类号】：TB485.1
【正文快照】： 家电行业竞争越来越激烈,成本成为制约其发展的瓶颈,在满足产品功能和质量要求的基础上,各个企业都在想方设法地降低成本,如改变产品结构、材料等方法。从Mindlin发表了关于缓冲包装的论文开始,缓冲材料的力学特征、产品脆值测试、包装动力学模型、运输包装设计法相继被提出,

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