微小器件装配系统的高精度控制技术研究

发布时间：2018-06-19 01:24

本文选题：微小器件 + 高精度　；参考：《沈阳理工大学》2017年硕士论文

【摘要】：随着微纳米技术的成熟,越来越多的精密型微小器件被生产和制造出来。对于这些精密、易损的微小器件来说,精密装配已经不是手工装配所能完成的任务,因此,对于精密型微小器件的装配系统已逐渐成为业界关注的焦点。本文针对真空吸附式的微小器件装配系统,主要研究内容如下:首先,研究了微小器件装配系统的总体技术,各个系统功能的构成以及相互之间的协作关系,并提出了相应的提高系统装配精度的装配方法,然后对整个装配系统的高精度进行分析。其次,对微小器件装配系统的运动坐标轴进行了X、Y坐标轴的定位精度研究,并通过误差补偿的方式提高系统的运动精度。对XY轴插补运动进行了研究和实验,并进行了XY的角度补偿,明显提高了系统精度。分析了两种运动形式的精度,并选择了最优路径法,达到高精度控制作用。由于在微小器件装配过程中,微小件对外界环境具有很强的敏感性,容易产生零件的微小窜动,为了提高微小器件装配系统的鲁棒性,本文针对微小零件在运行过程中产生的相对夹持器的错位进行分析,并提出了相应的优化方法。再次,由于微小器件装配的过程,需要借助数字图像处理技术来辅助装配,为了使系统达到更高的识别精度和特征提取精度,首先对视觉系统的核心部件相机的外参数进行了矫正,并提出了一种基于模板面积的二分法来自动选取阈值的方法,该方法与传统的阈值自动选取方法相比,能够达到更高的识别和特征提取精度,并对提取的器件特征开发了最佳平衡点的特征定位方式,使装配系统精度满足微米级装配的要求。最后,介绍了微小器件装配的装配精度及其测量原理,并将机器视觉系统应用到器件装配结果检测中,提出了一种基于特征点特征线位置的装配精度测量方法,并用该方法对微小器件装配完成后的位置和角度进行了测量。实验结果表明本方法能够快速准确测量出器件的装配装配精度,测量精度可达到微米级。
[Abstract]:With the development of micro-and nano-technology, more and more precision micro-devices are produced and manufactured. For these precision and vulnerable micro devices, precision assembly is no longer a task that can be accomplished by manual assembly. Therefore, the assembly system of precision micro devices has gradually become the focus of attention in the industry. The main contents of this paper are as follows: firstly, the overall technology of the assembly system of micro devices, the composition of each system function and the relationship between each other are studied. The assembly method to improve the assembly accuracy of the whole assembly system is put forward, and the high precision of the whole assembly system is analyzed. Secondly, the positioning accuracy of the moving coordinate axis of the micro-device assembly system is studied, and the motion accuracy of the system is improved by the way of error compensation. The motion of XY axis interpolation is studied and experimented, and the angle compensation of XY is carried out, which obviously improves the precision of the system. The precision of two kinds of motion forms is analyzed, and the optimal path method is chosen to achieve high precision control. In order to improve the robustness of the assembly system of micro devices, micro parts are sensitive to the external environment and can easily cause small movement of parts in the process of assembly of micro devices. In this paper, the dislocation of the relative gripper produced in the running process of small parts is analyzed, and the corresponding optimization method is put forward. Thirdly, because of the assembly process of micro devices, we need to use digital image processing technology to assist the assembly, in order to make the system achieve higher recognition accuracy and feature extraction accuracy. Firstly, the external parameters of the camera, the core component of the visual system, are corrected, and a method of automatically selecting the threshold value based on template area is proposed, which is compared with the traditional automatic threshold selection method. It can achieve higher recognition and feature extraction accuracy, and develop the best equilibrium feature location method for the extracted device features, so that the assembly system accuracy can meet the requirements of micron assembly. Finally, the assembly accuracy and its measuring principle of micro device assembly are introduced, and the machine vision system is applied to device assembly result detection, and an assembly accuracy measurement method based on feature line position is proposed. The position and angle of micro devices after assembly are measured by this method. The experimental results show that this method can quickly and accurately measure the assembly accuracy of the device, and the measurement accuracy can reach the micron level.
【学位授予单位】：沈阳理工大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TH-39

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