一种微构件拉伸测试系统及测试结构设计

发布时间：2018-06-21 15:17

  本文选题：MEMS + 拉伸测试　； 参考：《应用力学学报》2017年05期

【摘要】：微机电系统(Micro-Electro-Mechanical Systems,MEMS)的力学性能是研究MEMS可靠性的一个重要部分。目前,微结构片外拉伸测试的难点在于如何在实现较高精度的夹持和测试的同时能够较好地控制成本,这是本文着重解决的问题。首先,针对单晶硅各向异性湿法体硅工艺的特点,设计了一种新颖而经济的试样结构,利用力学分析确定其结构尺寸,通过有限元分析验证其合理性;其次,设计了一种简单经济的微结构片外拉伸测试系统;最后,加工出样本并进行准静载拉伸强度测试。结果表明:微梁尺寸增大,拉伸强度降低,同时验证了本装置在微结构拉伸准静载测试中的适用性。
[Abstract]:The mechanical properties of Micro-Electro-Mechanical Systems (MEMS) are an important part of MEMS reliability research. At present, the difficulty of the micro-structure out-of-chip tensile testing is how to achieve high precision clamping and testing at the same time to better control the cost, which is the focus of this paper. Firstly, according to the characteristics of anisotropic wet bulk silicon process, a novel and economical sample structure is designed. The structural size is determined by mechanical analysis, and the rationality is verified by finite element analysis. A simple and economical out of chip tensile test system is designed. Finally, the sample is processed and the tensile strength of quasi static load is tested. The results show that the size of the micro-beam increases and the tensile strength decreases, and the applicability of the device in the quasi-static load test of the micro-structure is verified at the same time.
【作者单位】： 南昌大学科学技术学院;
【基金】：江西省高等学校教学改革研究省级课题(JXJG-15-30-3)资助项目
【分类号】：TH-39
，

本文编号：2049209