Cu-Au-Ag三元去合金化制备纳米多孔金材料

发布时间：2018-03-30 22:05

  本文选题：纳米多孔金　切入点：三元去合金化　出处：《功能材料》2017年07期

【摘要】：采用磁控溅射镀铜金银多层膜,经过长时间高温热处理合金化制备前驱体三元合金,以不同的酸溶液自由腐蚀去合金化去除合金中的铜元素和银元素,成功制备出纳米多孔金薄膜。采用扫描电镜和X射线能谱仪对去合金腐蚀前后样品的形貌和成分进行了分析。结果表明,400℃,36h热处理后铜金银多层膜完全合金化,获得了Au_3Ag_(28.5)Cu_(68.5)合金材料;FeCl_3+HCl溶液自由腐蚀去除铜可获得连续均匀的纳米尺寸孔隙结构,获得了几乎不含铜的样品;采用渐进浓度的硝酸自由腐蚀去合金化后去除银后获得了孔隙率约84%的纳米多孔金薄膜,其微观结构为连续的三维多孔结构,其系带尺寸10~35nm,并且20~25nm的系带分布达77%。
[Abstract]:The precursor ternary alloy was prepared by magnetron sputtering copper, gold and silver multilayers, and alloyed for a long time at high temperature. Copper and silver elements in the alloy were removed by free corrosion and alloying with different acid solutions. Nano-porous gold films were successfully prepared. The morphology and composition of the samples before and after dealloying were analyzed by scanning electron microscopy and X-ray energy spectrometer. The results showed that copper gold and silver multilayers were completely alloyed after heat treatment at 400 鈩，

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