爽滑性聚酰亚胺薄膜的制备与性能研究

发布时间：2018-04-28 03:42

本文选题：Si + O_　；参考：《绝缘材料》2017年06期

【摘要】：采用Si O_2与聚酰胺酸复合,制备了具有爽滑性的聚酰亚胺(PI)薄膜,对薄膜的拉伸强度、断裂伸长率、动摩擦因数等性能进行测试分析,并采用SEM、TMA和TGA对薄膜进行表征。结果表明:未添加Si O_2的PI薄膜表面光滑,动摩擦因数为0.568,薄膜卷起后无爽滑性,容易产生粘连。加入Si O_2后,Si O_2可在PI薄膜表面形成弧形凸起,使动摩擦因数下降,爽滑性提高。当加入平均粒径为1.5μm、质量分数为0.1%~0.8%的Si O_2粒子时,随着Si O_2质量分数的增加,PI薄膜的拉伸强度和断裂伸长率不断增大,热膨胀系数缓慢降低,耐热性增加,动摩擦因数为0.423~0.377,可避免PI薄膜在生产应用过程中出现粘连问题。
[Abstract]:Polyimide (Pi) thin films with smooth properties were prepared by SiO2 and polyamide acid. The tensile strength, elongation at break and friction coefficient of the films were tested and analyzed. The films were characterized by SEM-TMA and TGA. The results show that Pi thin films without SiO2 have smooth surface and dynamic friction coefficient of 0.568. After the addition of Sio _ 2, arc protrusions can be formed on the Pi film surface, resulting in the decrease of the dynamic friction coefficient and the improvement of the smoothness. When the average particle size is 1.5 渭 m and the mass fraction of Sio _ 2 is 0.1%, the tensile strength and elongation at break of Pi films increase with the increase of mass fraction of Sio _ 2, the thermal expansion coefficient decreases slowly and the heat resistance increases. The dynamic friction coefficient is 0.423 ~ 0.377.It can avoid the adhesion of Pi film in the process of production and application.
【作者单位】：桂林电器科学研究院有限公司;
【基金】：桂林市科学研究与技术开发计划项目(2016010705)
【分类号】：TB383.2;TQ317

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