金刚石化学镀镍磷合金及在电镀金刚石切割线上的应用
发布时间:2018-06-29 05:55
本文选题:金刚石 + 化学镀 ; 参考:《青岛科技大学》2015年硕士论文
【摘要】:随着对硅晶体材料需求量的日益增加,对其所提出的加工要求也越来越高。其中电镀金刚石切割线凭借着高切割效率、高而稳定的切片质量、高成品率、长使用寿命及低污染等诸多优势,在硅锭的开方、切片以及陶瓷、玻璃、石材等硬脆材料的切割加工领域得到快速发展,应用前景越来越明朗。它作为一种金刚石工具,受到越来越多研究人员的欢迎和关注,逐步代替传统的切割工具而成为硬脆材料加工的一种新的切割工具。本文针对电镀金刚石切割线存在的制备周期长以及金刚石表面的镍磷合金层在镀液中易受破坏的问题进行相应试验方法来进行研究。因金刚石颗粒表面镍磷合金层的相关性能难以检测,本文借助以铜片、玻璃片为基体来制备镍磷合金层,分别研究了磷含量及热处理条件对其硬度、耐腐性及导电性能的影响。在镍磷合金层确定中磷含量的条件下,本文选用粒径为30-40μmm的金刚石颗粒。首先采用化学镀的方法在金刚石表面镀镍磷合金,然后进行相应的热处理,最后采用扫描电子显微镜(SEM)对热处理后的金刚石表面微观形貌进行观察、能谱分析(EDS)以及X射线衍射仪对金刚石表面的组织结构进行物相分析(XRD)。结果表明:在一定范围内,随热处理温度的升高,镀层表面变得越平滑。经过400℃C热处理时,镀层表面最平滑;500℃热处理时,镀层表面变粗糙。由X射线衍射图谱得知,镀态试样经过300℃C热处理时,镀层开始晶化,析出Ni相和Ni7P3相;经过500℃C热处理时,析出了Ni3P相,此时晶化比较完全,实现了由非晶态往晶态的转变过程。由机械搅拌实验得知,经过300℃、400℃C热处理的金刚石颗粒在电镀液中至少可存放48h。在相同的工艺条件下,选用未热处理及经过300℃℃热处理的金刚石颗粒分别进行霍尔槽上砂试验,并确定最佳的工艺参数。研究发现:采用300℃℃热处理的金刚石颗粒的上砂量比前者多,上砂效率明显提高。采用基体规格为Φ0.18mm镀铜高碳钢丝,采用氨基磺酸型镀液,金刚石颗粒为未热处理及300℃热处理的。在确定的工艺参数下,分别制备电镀金刚石切割线,并对油石进行切割试验。研究发现:采用300℃C热处理的金刚石制作的电镀金刚石切割线切割油石表面质量高,切口整齐,符合使用性能的要求。
[Abstract]:With the increasing demand for silicon crystal materials, the processing requirements are higher and higher. Among them, electroplated diamond cutting line has many advantages, such as high cutting efficiency, high and stable slice quality, high yield, long service life and low pollution. The cutting and processing field of hard and brittle materials such as stone has been developed rapidly, and the application prospect is more and more clear. As a kind of diamond tool, it has been welcomed and paid more and more attention by more and more researchers. It has gradually replaced the traditional cutting tools and become a new cutting tool for hard and brittle materials. In this paper, the problems of the long preparation period of electroplated diamond cutting line and the problem that the Ni-P alloy layer on the diamond surface is easily destroyed in the plating solution is studied in this paper. Because the correlation of Ni-P alloy layer on the surface of diamond particles is difficult to detect, the effects of phosphorus content and heat treatment conditions on hardness, corrosion resistance and electrical conductivity of Ni-P alloy layer were studied by means of copper sheet and glass substrate. Under the condition of determining the content of middle phosphorus in the Ni-P alloy layer, the diamond particles with the diameter of 30-40 渭 mm were selected in this paper. Firstly, Ni-P alloy was deposited on diamond surface by electroless plating, then the corresponding heat treatment was carried out. Finally, the microstructure of diamond surface after heat treatment was observed by scanning electron microscope (SEM). The microstructure of diamond surface was analyzed by energy dispersive spectroscopy (EDS) and X-ray diffractometer (XRD). The results show that the surface of the coating becomes smoother with the increase of heat treatment temperature in a certain range. After 400 鈩,
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