LED灯具寿命加速试验方法研究
[Abstract]:With the rapid development of LED technology, the light efficiency of LED light source is increasing and the cost is decreasing. Compared with ordinary incandescent lamp and fluorescent lamp, LED light source has high luminous efficiency and good energy saving. Long-life LED lamps have been widely used in life. Because of the long life characteristic of LED lamps, it is very important to study the accelerated life test method of LED lamps. In addition, because LED will produce a lot of heat in the working process, leading to the rise of chip junction temperature, which seriously affects the performance and life of LED lamps, so it is of great significance to study the heat dissipation performance of LED lamp heat dissipation device. At present, the accelerated life test with single stress is commonly used in the life test of LED lamps. In order to reduce the test time, this paper designs a double accelerated life test scheme under two stress conditions: temperature and humidity. At the same time, the life evaluation method is used to calculate the life of the test data. Aiming at the research of the heat dissipation effect of the heat dissipation device in LED lamps, this paper uses the method of FLOEFD simulation software and the actual measurement to analyze the heat dissipation effect of different heat dissipation devices of the sample lamps and the influence on the LED junction temperature. The main contents of this thesis are as follows: (1) the accelerated life test with temperature stress and humidity stress as accelerated stress is designed for LED lamp life test, and the flux attenuation is 70% of the initial luminous flux as the failure criterion. The test time is shortened effectively. (2) using FLOEFD simulation software to simulate and analyze the heat dissipation device used in the sample lamps, and comparing it with the actual measured data. (3) the luminous flux test data obtained from the accelerated life of LED lamps are compared and verified. The product life distribution is described by Weibull distribution, and the test data are statistically analyzed by using the least square method and the Arrhenis model Peck model. Finally, the life of the product under normal stress level is extrapolated.
【学位授予单位】:厦门理工学院
【学位级别】:硕士
【学位授予年份】:2017
【分类号】:TM923.34
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