合肥研究院在先进电子封装材料研究中取得系列进展
发布时间：2019-06-17 13:19
【摘要】：正近日,中国科学院合肥物质科学研究院应用技术研究所先进材料中心研发团队,在先进电子封装材料研究方面取得系列进展。新型处理器的运行速度越来越快,高性能仪器的能耗在不断增加,这迫使廉价的"辅助基板"或"依赖设备"要跟上发展的步伐,热管理技术逐渐成为工程师们必须考虑的问题,对绝缘场合用作封装和热界面材料使用的高热绝缘材料的需求越来越高。在半导体管与散热器的封装、管芯的保护、
[Abstract]:Recently, the research and development team of Advanced Materials Center of Institute of Applied Technology, Hefei Institute of material Science, Chinese Academy of Sciences, has made a series of progress in the research of advanced electronic packaging materials. The running speed of the new processor is getting faster and faster, and the energy consumption of high performance instruments is increasing, which forces the cheap "auxiliary substrate" or "dependent equipment" to keep up with the development. Thermal management technology has gradually become a problem that engineers must consider, and the demand for high thermal insulation materials used as packaging and thermal interface materials is getting higher and higher. In semiconductor tube and radiator packaging, tube core protection,
【分类号】：TM21
，
本文编号：2501016
[Abstract]:Recently, the research and development team of Advanced Materials Center of Institute of Applied Technology, Hefei Institute of material Science, Chinese Academy of Sciences, has made a series of progress in the research of advanced electronic packaging materials. The running speed of the new processor is getting faster and faster, and the energy consumption of high performance instruments is increasing, which forces the cheap "auxiliary substrate" or "dependent equipment" to keep up with the development. Thermal management technology has gradually become a problem that engineers must consider, and the demand for high thermal insulation materials used as packaging and thermal interface materials is getting higher and higher. In semiconductor tube and radiator packaging, tube core protection,
【分类号】：TM21
，
本文编号：2501016
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