高速连接器信号完整性研究

发布时间：2018-03-30 07:15

本文选题：高速背板连接器　切入点：信号完整性　出处：《北京邮电大学》2015年硕士论文

【摘要】：在传输速率高达数Gbps的高速数字系统中,由于高速信号的有效频率已经达到微波频段甚至是毫米波频段,在信号传输过程中,会由于传输线效应而引发信号完整性问题。此时传统的分析方法已经无法达到高速产品性能的要求。信号完整性主要研究的是如何使信号以准确的时序和可接受的电压幅值到达接收端,并使接收端作出正确的响应。当前国内对20Gbps以上高速连接器的信号完整性研究并不多见,加上目前高端武器的研发和民用市场对高速连接器的需求,本文以高速背板连接器(传输速率为20Gbps)为研究对象,并结合信号完整性分析理论,利用三维高频结构仿真软件HFSS对该高速背板连接器进行频域分析和参数的提取,同时利用电路仿真软件Ansoft Designer对高速背板连接器分别进行电磁、电路的协同仿真。通过仿真结果分析影响高速连接器频域特性(插入损耗、回波损耗、近端串扰、远端串扰)和时域特性(特性阻抗、眼图分析、误码率)的影响因素。同时利用矢量网络分析仪(VNA),时域反射计对连接器的高速技术指标进行精确、稳定地测试,进而通过测试结果分析、验证被测连接器的高速传输性能。通过仿真结果的对比分析可知,控制PCB传输晶片铜箔粗糙度可以有效减小信号的损耗；差分微带线之间增加隔离过孔,可以有效的消除谐振现象,同时还增加了差分对间的隔离度,减小了差分对间的串扰。本课题根据高速连接器的设计要求,搭建了一整套针对信号完整性问题的测试系统,通过实际测试验证了仿真的结果和高速连接器的传输性能。
[Abstract]:In a high-speed digital system with a transmission rate of up to several Gbps, since the effective frequency of the high-speed signal has reached the microwave band or even the millimeter-wave band, in the process of signal transmission, Because of the transmission line effect, the problem of signal integrity can be caused, and the traditional analysis method can no longer meet the requirements of high-speed product performance. The main research of signal integrity is how to make the signal arrive at the receiver with accurate timing and acceptable voltage amplitude, and make the receiver make correct response. At present, there are few researches on the signal integrity of high speed connectors above 20Gbps in our country. In addition to the current research and development of high-end weapons and the demand for high-speed connectors in the civil market, this paper takes the high-speed backplane connector (transmission rate is 20Gbps) as the research object, and combines with the theory of signal integrity analysis. The frequency domain analysis and parameter extraction of the high speed backplane connector are carried out by using three dimensional high frequency structure simulation software HFSS, and the high speed backplane connector is separately electromagnetic by circuit simulation software Ansoft Designer. The simulation results are used to analyze the frequency domain characteristics (insertion loss, echo loss, near end crosstalk, remote crosstalk) and time domain characteristics (characteristic impedance, eye diagram analysis) of high speed connectors. At the same time, the high speed technical index of the connector is tested accurately and stably by using the vector network analyzer (VNAN) and time domain reflectometer, and the high speed transmission performance of the tested connector is verified through the analysis of the test results. Through the comparison and analysis of the simulation results, it can be seen that controlling the copper foil roughness of the PCB transmission wafer can effectively reduce the loss of the signal, and increase the isolation hole between the differential microstrip lines, which can effectively eliminate the resonance phenomenon. At the same time, the isolation between differential pairs is increased, and the crosstalk between differential pairs is reduced. According to the design requirements of high-speed connectors, a set of testing system for signal integrity is built. The simulation results and the transmission performance of the high speed connector are verified by actual test.
【学位授予单位】：北京邮电大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TM503.5

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