温度与振动耦合条件下的电路板级焊点失效模式与疲劳寿命分析

发布时间：2018-01-15 00:03

  本文关键词：温度与振动耦合条件下的电路板级焊点失效模式与疲劳寿命分析　出处：《电子学报》2017年07期 　论文类型：期刊论文

  更多相关文章： 温度与振动耦合 焊点 失效模式 疲劳寿命

【摘要】：基于正交试验法研究不同温度与振动耦合条件下的板级焊点失效行为与模式,采用L9(34)混合水平正交表设计了不同温度(T)、加速度功率谱密度(PSD)与频率(V)条件下的加速寿命试验,结果表明三者对焊点可靠性影响程度为TPSDV,且温度是影响焊点失效模式的主要因素,随温度的升高,焊点裂纹逐渐从近封装侧的界面金属化合物(IMC)层向钎体内部扩展,焊点失效模式从脆性断裂向韧性断裂演化.基于焊点失效数据分析,发现焊点疲劳寿命对数值与PCB板背侧最大应变范围存在关联关系,并采用多项式拟合的方法建立了焊点疲劳寿命模型,拟合结果显示,该模型能较好的评估温度与振动耦合条件下的焊点寿命,预测精度较高.
[Abstract]:Based on the orthogonal test method, the failure behavior and mode of plate grade solder joints under different temperature and vibration coupling conditions are studied. Different temperatures are designed by using L9 / 34) mixed horizontal orthogonal table. The accelerated life tests under the conditions of acceleration power spectrum density (PSD) and frequency density (V) show that the effect of the three factors on the reliability of solder joint is TPSDV. Temperature is the main factor affecting the failure mode of solder joint. With the increase of temperature, the crack of solder joint extends gradually from the interface metal compound (IMC) layer near the package side to the inner part of the solder. The failure mode of solder joint evolves from brittle fracture to ductile fracture. Based on the analysis of the failure data of solder joint, it is found that there is a correlation between the fatigue life of solder joint and the maximum strain range on the back of PCB plate. The fatigue life model of solder joint is established by polynomial fitting. The fitting results show that the model can better evaluate the solder joint life under the coupling condition of temperature and vibration, and the prediction accuracy is higher.
【作者单位】： 空军工程大学航空航天工程学院;
【基金】：陕西省自然科学基金(No.2015JM6345) 航空科学基金(No.20142896022)
【分类号】：TN406
【正文快照】： 1引言在电子设备中,电子芯片通过焊点实现与电路板之间的机械固定与电气互联.随着电子制造技术的进步,焊点尺寸越来越小,密度越来越高,电子设备的服役环境却越来越严酷,尤其是在航空航天与军事领域,机载或弹载电子设备通常工作在高、低温频繁转换与振动等恶劣环境中,板级焊点，

本文编号：1425870