晶振基座的LTCC设计与制作

发布时间：2018-01-29 03:33

本文关键词： LTCC工艺流延收缩基板　出处：《电子科技大学》2015年硕士论文　论文类型：学位论文

【摘要】：为应对无线通信的飞速发展,电子产品的小型化、高可靠性等变的越来越重要。电子封装技术成为电子行业领域中一个不可缺少的重要组成。根据电子封装对于基板的要求:低温烧结、良好的介电性能、与芯片的热膨胀系数相近,机械性能良好,散热性能强等,参考国内外文献的LTCC材料组成,选择了材料组成成分,获得了适宜粉体,重点对工艺进行了探讨和实现,获得了最终的样品。对样品用扫描电子显微镜、阻抗分析仪、热膨胀系数测定仪等做了结果分析,并从理论解释。流延工艺中,研究各种有机添加剂(分散剂、粘结剂和增塑剂等)对浆料流变性的影响,以获得性能良好的生带为目标。最终确定浆料组成,浆料粘度在1300MPa·s。研究丝网印刷的网版质量和参数、操作水平对于电极的印刷的影响,电极浆料粘度确定为26万,两次印刷。生带的干燥工艺对于生带性能的影响非常大,通过对干燥过程机理的研究,发现在现有条件下(浆料已确定),即使改进了干燥工艺,实行两面干燥,生带的厚度也不能超过0.4 cm,否则生带会出现裂纹,不能够成为基板。后来者可以通过改变微观结构改变该善性能。LTCC材料与银的共烧是实现样品整体小型化的一个关键,通过对工艺的改进实现共烧。其中收缩率的控制对于异质材料的共烧匹配有着重要作用。通过对收缩机理的研究,调整异质材料的收缩率和致密化温度,向浆料中添加氧化物降低致密温度和对银浆的一定的处理实现差异的缩小,可以更好地实现共烧匹配。最终烧成样品具有低的烧结温度(900°C)介电常数εr=6.5,谐振频率温度系数为τf=-2.5ppm/°C,介电损耗15500 GHz,抗弯强度在160 MPa,较差,分析是由于基板太薄,破坏了整体的机械性能。整体的工艺改进可以通过调整工艺参数和微观组成以获得性能更优良的基板。
[Abstract]:In order to cope with the rapid development of wireless communications, the miniaturization of electronic products. High reliability is becoming more and more important. Electronic packaging technology has become an indispensable component in the field of electronics. According to the requirements of electronic packaging for substrate: low temperature sintering good dielectric properties. The thermal expansion coefficient of the chip is close, the mechanical property is good, the heat dissipation performance is strong, and so on. Referring to the composition of LTCC material in domestic and foreign literature, the composition of the material is selected, and the suitable powder is obtained. The final sample was obtained by means of scanning electron microscope, impedance analyzer, thermal expansion coefficient tester, and so on. The effect of various organic additives (dispersant, binder and plasticizer etc.) on the rheological properties of slurry was studied. The paste viscosity was 1 300 MPA 路s. The quality and parameters of screen printing were studied. The effect of operation level on electrode printing was studied. The paste viscosity of electrode was determined to be 260,000. The drying process of raw strip has a great influence on the properties of raw strip. By studying the mechanism of drying process, it is found that under the existing conditions (the slurry has been determined, even if the drying process has been improved. If drying on both sides, the thickness of the belt should not exceed 0.4 cm, otherwise, cracks would appear in the belt. It is a key to realize the miniaturization of the sample by changing the microstructure of the material and coburning the LTCC material with silver. The control of shrinkage rate plays an important role in the co-firing matching of heterogeneous materials. Through the study of shrinkage mechanism, the shrinkage rate and densification temperature of heterogeneous materials are adjusted. The addition of oxides to the slurry reduces the densification temperature and reduces the difference between the silver paste and the paste. The co-firing matching can be realized better. The final sintering sample has low sintering temperature (900 掳C), the dielectric constant 蔚 r = 6.5, and the resonant frequency temperature coefficient 蟿 f ~ (-2.5) ppm / 掳C. Dielectric loss of 15500 GHz, bending strength at 160 MPA, poor, the analysis is due to the substrate is too thin. The overall process improvement can be achieved by adjusting the process parameters and microcosmic composition to obtain the better performance of the substrate.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN05

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