硅片检测平台的结构设计与误差测试分析

发布时间：2018-02-11 09:51

本文关键词： 硅片检测机械结构设计定位精度误差实验　出处：《华中科技大学》2015年硕士论文　论文类型：学位论文

【摘要】：如今的IC制造工业属于IC技术的核心,是最受设计厂商关注的部分,也是企业投资最多的部分。而作为半导体制造的基础,硅片检测与制造技术是最为重要的环节。本文基于硅片制造技术为背景,对硅片检测过程的精密检测设备进行设计和研究。首先,针对本课题硅片检测平台的设计需求和技术参数,对比三自由度和四自由度的优缺点,选择并设计出适合本课题的平台总体方案。并根据课题提出的精度要求,对运动平台的三轴使用的驱动方式进行分析与选择。开展了气缸、音圈电机、光栅尺和滚动导轨等关键部件的分析、选型与校核,完成了硅片检测平台的结构设计和样机研制。开展了垂向精密运动机构的精密定位实验,结果表明其垂向定位精度达到±0.1μm,满足设计要求。最后,本文针对硅片平台样机,进行了硅片检测平台Z向的动态误差测试。通过对Z向零部件的误差测试,分析了Z向误差造成的因素,针对样机的结构及驱动方式,进行了硅片平台的结构改进,并针对硅片检测平台提出多自由度的耦合误差分析。
[Abstract]:Today's IC manufacturing industry belongs to the core of IC technology, is the most concerned part of the design manufacturers, is also the largest part of the enterprise investment. And as the basis of semiconductor manufacturing, Wafer detection and manufacturing technology is the most important link. Based on the background of wafer manufacturing technology, this paper designs and studies the precision detection equipment in the process of wafer detection. According to the design requirements and technical parameters of the silicon wafer detection platform, the paper compares the advantages and disadvantages of three degrees of freedom and four degrees of freedom, selects and designs the overall scheme of the platform suitable for this subject, and according to the precision requirements of the subject, This paper analyzes and selects the driving mode of the three-axis motion platform. The key components, such as cylinder, voice coil motor, grating ruler and rolling guide rail, are analyzed, selected and checked. The structure design and prototype development of the wafer detection platform are completed. The precision positioning experiment of the vertical precision motion mechanism is carried out. The results show that the vertical positioning accuracy reaches 卤0.1 渭 m, which meets the design requirements. Finally, the paper aims at the prototype of the silicon wafer platform. The dynamic error test of Z direction of silicon wafer detection platform is carried out. Through the error test of Z direction parts, the factors caused by Z direction error are analyzed, and the structure of silicon wafer platform is improved according to the structure and driving mode of the prototype. The coupling error analysis of multi-degree-of-freedom (MDOF) is proposed for silicon wafer detection platform.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN304.12

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