基于柔性基板的微应变片阵列研究

发布时间：2018-04-04 09:14

本文选题：半导体应变片　切入点：粘弹性　出处：《华中科技大学》2015年硕士论文

【摘要】：半导体应变片由于其灵敏系数大、横向效应小、尺寸参数小等特点被广泛使用,粘弹性材料聚酰亚胺是一种综合性能非常优异的高分子材料,具有优异的机械性能,突出的电气绝缘性能和优良的抗辐射性能等,常用在各种电气和电子的用途中。本论文中研究的基于柔性基板的微应变片阵列,主要用于监测重型机械关键部位的应变和应力,它正是结合了上述两者的优势,致力于增加整个系统的灵敏系数和延性。本论文的主要研究内容有:首先,在对半导体应变片的工作特性进行深入研究的基础上,选择合适的应变片材料和基底材料。在进行粘弹性有限元建模分析之前,必须知道粘弹性材料的特征参数,它一般只能通过实验或经验的方法来获得。本论文中采用实验的方法和结合一种成熟的计算方法来确定粘弹性材料聚酰亚胺的广义Maxwell模型的特征参数。其次,采用ANSYS软件对单个半导体应变片建立粘弹性有限元模型,选择合适的尺寸数据,通过仿真计算来确定硅的最大应变和平均应变随各个尺寸参数的变化规律,根据需要选择合适的尺寸参数。选择单个应变片单元的组合形式,并确定合理的微应变片阵列布局方案。最后,在对与微应变片阵列工艺过程相关的微细加工技术进行深入研究的基础上,设计出其合理的加工工艺流程。
[Abstract]:Semiconductor strain gauges are widely used because of their high sensitivity coefficient, small transverse effect and small size parameters. The viscoelastic material polyimide is a kind of polymer material with excellent comprehensive properties and excellent mechanical properties.Outstanding electrical insulation and excellent radiation resistance, often used in various electrical and electronic applications.The microstrain gauge array based on flexible substrate is mainly used to monitor the strain and stress of the key parts of heavy machinery in this paper. It combines the advantages of the above two methods and is devoted to increase the sensitivity coefficient and ductility of the whole system.The main contents of this thesis are as follows: firstly, on the basis of in-depth study on the working characteristics of semiconductor strain gauges, appropriate strain gauge materials and substrate materials are selected.The characteristic parameters of viscoelastic materials must be known before the viscoelastic finite element modeling and analysis, which can only be obtained by experimental or empirical methods.In this paper, the characteristic parameters of the generalized Maxwell model of viscoelastic polyimide are determined by experimental method and a mature calculation method.Secondly, the viscoelastic finite element model of a single semiconductor strain gauge is established by using ANSYS software, and appropriate size data are selected to determine the variation of the maximum strain and average strain of silicon with each dimension parameter through the simulation calculation.Select the appropriate size parameters according to the need.The combination form of single strain gauge element is selected, and the reasonable microstrain gauge array layout is determined.Finally, on the basis of the deep research on the micromachining technology related to the microstrain gauge array process, the reasonable processing process is designed.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN304

【相似文献】