PCB微孔导电石墨乳液的研制

发布时间：2018-04-16 02:34

  本文选题：印制电路板微孔导电化处理 + 膨胀石墨　； 参考：《南京理工大学》2015年硕士论文

【摘要】：随着科学技术的发展,电子产品越来越向小型化、多功能化发展,由此导致印制线路板的层间通联孔径也越来越小。这些微孔的导电化处理是高端印制线路板封装工艺的重要工序。由于石墨乳液具有操作简便、无环境污染等特点,近些年来在日本、韩国、美国和欧盟等电子产品生产技术强国得到了高度重视和发展,并逐步取代传统的化学镀工艺,广泛应用于印制线路板的制造。本文主要研究导电石墨乳液的导电原理、方法和技术。针对印制线路板的层间联通孔径最小已低于1mm的技术要求,以微米石墨为原料,通过插层改性处理和高温膨化,制备出膨胀石墨。然后,基于所制备的膨胀石墨,研制了在印制线路板微孔壁面具有良好成膜能力和导电性能的石墨乳液。具体研究内容如下：基于石墨的结构和物理化学性质,设计了导电石墨乳液的组成、微米石墨的氧化插层改性方法。以超细微米级石墨为原料,采用化学氧化法,以NA-PP-PA-AA为氧化插层体系制备了可膨胀石墨；通过单因素实验,确定了由微米级石墨制备可膨胀石墨的工艺。FTIR和SEM等测试分析结果表明,反应试剂的基团插入到了石墨层间,并形成了石墨层间化合物。由微米级石墨制备的膨胀石墨,体积增加了6倍。导电石墨乳液主要由所制备的膨胀石墨、有机粘结剂、水和助剂等组成。以膨胀石墨为导电物质,以RX-20为助剂,SP-33为有机粘结剂,研制了具有良好成膜能力、导电能力和稳定性的石墨乳液,并以塑料平板为基材进行了成膜及导电性工艺研究。实验结果表明,在25℃下,反应时间为2小时,由5%膨胀石墨、1.00%RX-20和6.00%SP-33组成的水性石墨乳液,最小表面电阻率只有2.36Ω/m2。SEM测试结果表明,所研制的石墨乳液可以在塑料实验板表面形成致密而均匀的导电涂层。以上研究的配方和工艺,为所研制的石墨乳液用于PCB板微孔导电化处理奠定了基础。基于上述所研制的以膨胀石墨为导电物质的石墨乳液,研究了PCB板微孔的导电化处理工艺,并分别对单层和多层(3-11)PCB,孔径分别为0.8mm、1mm和1.2mm的微孔进行了处理。结果表明,将单层和多层PCB板浸渍于所研制的石墨乳液中,浸渍4次,每次15min,干燥时间为1小时,即可满足PCB板后续处理的工艺要求。
[Abstract]:With the development of science and technology, electronic products are becoming more and more miniaturized and multifunctional. As a result, the interlayer connection aperture of printed circuit board (PCB) becomes smaller and smaller.The conductive treatment of these micropores is an important process of high-end printed circuit board packaging process.Because graphite emulsion is easy to operate and no environmental pollution, in recent years in Japan, South Korea, the United States and the European Union and other electronic products production technology countries have received great attention and development, and gradually replace the traditional electroless plating process.Widely used in the manufacturing of printed circuit boards.This paper mainly studies the conductive principle, method and technology of conductive graphite emulsion.In view of the technical requirement that the interlaminar connection aperture of printed circuit board is lower than that of 1mm, expanded graphite is prepared by intercalation modification and high temperature expansion with micron graphite as raw material.Then, based on the expanded graphite prepared, graphite emulsion with good film forming ability and conductive property on the microporous wall of printed circuit board (PCB) was developed.The main contents are as follows: based on the structure and physical and chemical properties of graphite, the composition of conductive graphite emulsion and the modification method of micrometer graphite oxide intercalation were designed.Expandable graphite was prepared from ultrafine micron graphite by chemical oxidation and NA-PP-PA-AA as oxidation intercalation system.The process of preparing expandable graphite from micron graphite was determined. FTIR and SEM showed that the group of reaction reagent was inserted into graphite interlayer and formed graphite interlaminar compound.The volume of expanded graphite prepared from micron graphite increased by 6 times.Conductive graphite emulsion mainly consists of expanded graphite, organic binder, water and auxiliaries.Graphite emulsion with good film forming ability, electrical conductivity and stability was prepared by using expanded graphite as conductive material and RX-20 as auxiliary agent SP-33 as organic binder. Film forming and electrical conductivity were studied using plastic plate as substrate.The experimental results show that the minimum surface resistivity of waterborne graphite emulsion composed of 5% expanded graphite 1.00 and RX-20 and 6.00%SP-33 is only 2.36 惟 / m ~ (2) SEM at 25 鈩，

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