不同工艺参数及喷淋板结构下PECVD热流场分析

发布时间：2018-04-26 18:36

本文选题：工艺参数 + PECVD　；参考：《人工晶体学报》2017年02期

【摘要】：建立了PECVD腔室的连续流体和传热模型,通过仿真实验来分析工艺参数和喷淋板结构对PECVD腔室热流场的影响。在典型工艺的基础上,根据单变量原则设计不同的仿真实验来研究工艺参数对晶圆片上方流速、压力及温度分布的影响,结果显示在不同的工艺参数下,流速分布都能够保持线性分布;温度分布波动很小,表现良好的稳定性;压力随径向近似抛物线分布,中心压力高边缘压力低。另外本文设计了两组仿真实验,研究喷淋板不同的流阻分布对热流场的影响,结果显示喷淋板流阻的分布对流速分布有明显的影响,在不同的流阻分布下,加热盘边缘处的流速保持不变,但是流速分布存在一个拐点,拐点前和拐点后流速都近似于直线分布;结果说明能够通过改变喷淋板流阻的分布来调控晶圆上方流速的分布从而获得更高的薄膜工艺均匀性。
[Abstract]:The continuous fluid and heat transfer model of PECVD chamber is established. The effects of process parameters and spray plate structure on the heat flow field of PECVD chamber are analyzed by simulation experiments. On the basis of typical technology, different simulation experiments are designed according to the principle of single variable to study the influence of process parameters on the flow rate, pressure and temperature distribution above the wafer. The results show that under different process parameters, The velocity distribution can keep linear distribution; the temperature distribution fluctuates very little and shows good stability; the pressure is nearly parabolic distribution with the radial, the center pressure is high and the edge pressure is low. In addition, two groups of simulation experiments are designed to study the effect of different flow resistance distribution of spray plate on heat flow field. The results show that the distribution of spray plate flow resistance has obvious influence on velocity distribution, under different flow resistance distribution, The velocity at the edge of the heating disk remains unchanged, but there is an inflection point in the velocity distribution, both before and after the inflection point, which are similar to the linear distribution. The results show that the distribution of flow velocity over the wafer can be adjusted by changing the distribution of the flow resistance of the spray plate to obtain a higher uniformity of the film process.
【作者单位】：清华大学机械系;清华大学深圳研究生院;
【基金】：国家科技重大专项资助项目(2011ZX02403)
【分类号】：TN304.055

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