Cu-Cu及Cu-Al的电镀Ni低温连接界面及连接强度的研究

发布时间：2018-05-03 20:40

  本文选题：低温连接 + 电镀镍　； 参考：《哈尔滨工业大学》2017年硕士论文

【摘要】：焊接界长期致力于寻找新的连接技术;经过多年的研究和发展,一些特种先进连接方法,如激光焊、电子束焊、摩擦焊以及微连接技术等已经成为了现代连接技术的重要组成部分。电镀作为一种已经发展相对成熟的表面改性工艺,其在连接领域的用途和潜力并未引起国内外学者足够的关注。本研究旨在通过电镀镍的方式对Cu-Cu试样以及Cu-Al试样进行连接,探索电镀工艺在连接领域的可行性及可靠性,使之成为一种具有特殊用途的新型连接技术。本文采用电镀镍的方式,对Cu-Cu试样以及Cu-Al试样进行了低温连接试验,探索了电镀连接工艺,通过透射电子显微镜等表征手段研究了连接界面的组织结构,分析了电流密度对镀镍连接层的影响,并通过单向拉伸试验测试了连接接头的抗拉强度;此外,本文还对Cu-Al试样进行了老化处理,分析了老化时间对Al/Ni界面金属间化合物的演化及其界面结合强度的影响。基于电镀Ni的Cu-Cu及Cu-Al的低温连接工艺,其电镀液配方以氨基磺酸镍为主盐,氯化镍为活化剂,硼酸为PH值稳定剂;得到了形貌均匀、内部致密的镀镍连接层,实现了Cu-Cu及Cu-Al的电镀Ni低温连接。Cu/Ni界面为一个60 nm宽度的Cu、Ni原子扩散区域,该区域是一层FCC结构的铜镍原子无限置换固溶体Cu_xNi_(1-x)。Al/Ni界面为一个宽度约为100 nm的Al、Ni原子扩散区域,界面中靠近Ni侧存在一个宽度约为20 nm的AlNi相,该相的晶体结构为BCC。Cu-Cu电镀Ni低温连接,接头抗拉强度为100~280 MPa,断口位于镀镍连接层或者铜基材;其连接强度可以超过基材本身。Cu-Al电镀Ni接头在老化前的平均连接强度为124 MPa,200℃恒温老化1000 h后为122 MPa,等温老化处理对Cu-Al电镀Ni接头强度无影响。此外,Cu-Al电镀Ni接头在200℃恒温老化1000 h后,Al/Ni界面并无IMC生长。镀镍连接层生长速度方向上硬度随电流密度增大而增大;而其垂直生长速度方向的硬度不受电流密度影响。镀镍连接层的晶粒在(111)、(200)以及(220)晶面法向上的平均厚度分别为188~208?、138~187?以及83~139?;电流密度越大,镀镍连接层的晶粒尺寸减小。
[Abstract]:After many years of research and development, some special advanced connection methods, such as laser welding, electron beam welding, Friction welding and micro-bonding technology have become an important part of modern bonding technology. Electroplating as a relatively mature surface modification process, its application and potential in the field of bonding has not attracted enough attention from domestic and foreign scholars. The purpose of this study is to study the feasibility and reliability of electroplating on Cu-Cu and Cu-Al samples by means of nickel plating, and to make it a new type of bonding technology with special application. In this paper, the low temperature bonding tests of Cu-Cu and Cu-Al samples were carried out by means of electroplating nickel, and the electroplating bonding process was explored. The microstructure of the interface was studied by means of transmission electron microscope (TEM). The effect of current density on the nickel coating is analyzed, and the tensile strength of the joint is tested by uniaxial tensile test. In addition, the aging treatment of Cu-Al sample is also carried out. The influence of aging time on the evolution and bonding strength of intermetallic compounds at Al/Ni interface was analyzed. The low temperature bonding process of Cu-Cu and Cu-Al based on electroplating Ni. The electroplating solution is composed of nickel aminosulfonate as main salt, nickel chloride as activator and boric acid as PH stabilizer. The electroplated Ni / Ni interface of Cu-Cu and Cu-Al is characterized by a 60nm Cu-Ni atom diffusion region. The interface of a layer of FCC structure copper-nickel atom infinite displacement solid solution Cu_xNi_(1-x).Al/Ni is a 100nm wide Alnio Ni atom diffusion region. There is a AlNi phase with a width of about 20nm near the Ni side of the interface. The crystal structure of the phase is BCC.Cu-Cu electroplated Ni low temperature bonding. The tensile strength of the joint is 100 ~ 280MPa. The fracture surface is located in the nickel-plated bonding layer or the copper substrate. The bonding strength can exceed that of the substrate itself. The average bonding strength of Cu-Al electroplated Ni joints before aging is 124MPa after aging at 200 鈩，

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