3D芯片绑定中测试绑定次序对成本的影响

发布时间：2018-06-28 04:11

  本文选题：丢弃成本 + 成本模型　； 参考：《电子学报》2017年09期

【摘要】：针对3D SICs(3D Stacked Integrated Circuits,三维堆叠集成电路)在多次绑定影响下的成本估算问题,现有的方法忽略了实际中经常发生的丢弃成本,从而使得理论的测试技术不能很好的应用于实际生产.本文根据绑定中测试的特点,提出了一种协同考虑绑定成功率与丢弃成本的3D SICs理论总成本模型.基于该模型,提出了一种3D SICs最优绑定次序的搜索算法.最后,进一步提出了减少绑定中测试次数的方法,实现了"多次绑定、一次测试",改进了传统绑定中测试"一绑一测"的方式.实验结果表明,本文提出的成本模型更贴近于实际生产现状,最优绑定次序、最优绑定中测试次数可以更加有效指导3D芯片的制造.
[Abstract]:In view of the cost estimation problem of 3D stacked Integrated Circuit (3D stacked Integrated Circuit) under the influence of multiple bindings, the existing methods ignore the discard cost that often occurs in practice, which makes the theoretical testing technology not well applied in practical production. According to the characteristics of binding testing, a 3D SICs theoretical total cost model considering binding success rate and dropping cost is proposed in this paper. Based on this model, a 3D SICs optimal binding order search algorithm is proposed. Finally, the method of reducing the number of tests in binding is put forward. The method of "multiple binding, one test" is realized, and the way of testing "one bound one test" in traditional binding is improved. The experimental results show that the cost model proposed in this paper is closer to the actual production situation, the optimal binding order and the test times in the optimal binding can guide the manufacture of 3D chip more effectively.
【作者单位】： 合肥工业大学;情感计算与先进智能机器安徽省重点实验室;中国电子科技集团第三十八研究所;
【基金】：国家自然科学基金重点项目(No.61432004);国家自然科学基金(No.61474035,No.61204046,No.61306049) 安徽省科技攻关(No.1206c0805039) 安徽省自然科学基金(No.1508085QF129) 教育部新教师基金(No.20130111120030)
【分类号】：TN407
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本文编号：2076675