印制电路板垂直高速电镀铜添加剂及性能研究
发布时间：2018-11-06 16:38
【摘要】：随着科学技术的提高,垂直连续电镀(VCP)线广泛应用于印制电路板行业。VCP电镀线相对于传统的龙门线,由于连续传动输送,具有极强的灌孔能力且镀铜均匀性好。因此对电镀铜光剂提出更高的要求,即在阴极电流密度较高时,通孔镀层需有较好的深镀能力,并且通孔镀层可靠性能满足电信号传输。目前国内电镀药水在阴极高电流密度深镀能力普遍偏低。因此本课题基于VCP线工艺特点,研究应用于VCP线电镀铜光剂。在赫尔槽和哈林槽初步筛选出酸性镀铜光剂基础配方,光剂各组分进行参数优化后光亮剂浓度为10~40 mg/L,整平剂浓度50~200 mg/L,抑制剂浓度100~1000 mg/L。在阴极电流密度3.5 A/dm~2时,测试样板厚2.0 mm,孔直径0.3 mm,镀层深镀能力可达70%,利用循环伏安剥离法建立光剂的分析方法,进行放大模拟实验。通过模拟VCP线槽进行放大模拟实验,研究光剂体系的镀铜层可靠性能。研究结果表明,在阴极电流密度4.0 A/dm~2时,板厚2.0 mm,纵横比10:1时,六点法深镀能力可到64.26%,解决了孔铜镀层偏薄问题。镀层抗热冲击性能在温度288℃,浸锡三次后无孔铜断裂。用扫描电子显微镜放大镀铜层形貌,均无柱状结晶,镀铜层结晶致密。电镀铜箔延展率均在20%以上。对镀铜光剂稳定性机理研究表明,在动态电镀过程中,往槽液中添加开缸稳定剂使光亮剂和整平剂的消耗速率变慢,同时发现添加醛类化合物对盲孔板底部拐角处镀铜层底部有一定加速镀层沉积作用。通过模拟放大实验和光剂稳定性机理研究表明,酸性电镀铜缸槽液优化参数如下:100 g/L五水硫酸铜,200 g/L硫酸,60 mg/L氯离子,15 mg/L光亮剂聚二硫丙烷磺酸钠(SPS),200 mg/L抑制剂聚乙二醇(PEG8000),200 mg/L抑制剂聚环氧乙烷与环氧丙烷共聚物(50HB),100 mg/L整平剂L2,1.0 g/L醛类化合物,喷流压力30~50赫兹(Hz),槽液温度20~26℃,其中整平剂L2的结构为含氮杂环类衍生物。在VCP产线试用镀铜光剂,镀层可靠性结果表明,在阴极电流密度3.0 A/dm~2时,镀层板面外观光亮,面铜厚度要求1.0密耳(mil),孔铜最薄处至少有0.7 mil以上,解决了高电流密度下通孔镀层偏薄问题。盲孔底部拐角处无螃蟹脚现象,可以实现通盲孔共浴电镀。镀铜层在温度288℃下浸锡三次无孔铜断裂,电镀铜箔延展率在20%以上,该酸性镀铜光剂可应用于印制电路板VCP线试用。
[Abstract]:With the development of science and technology, the vertical continuous electroplating (VCP) line is widely used in the printed circuit board industry. Compared with the traditional gantry line, the VCP electroplating line has strong capacity of filling holes and good uniformity of copper plating due to continuous transmission. Therefore, a higher requirement is put forward for copper electroplating, that is, when the cathode current density is high, the through hole coating should have better deep plating ability, and the reliability of the through hole coating can satisfy the transmission of electrical signal. At present, the cathodic high current density deep plating capacity of domestic electroplating solution is generally low. Therefore, based on the process characteristics of VCP line, the research is applied to copper electroplating agent for VCP wire. The basic formula of acid copper-plating gloss agent was preliminarily screened in Hull trough and Harling trough. The concentration of brightener was 10 ~ 40 mg/L, the concentration of inhibitor was 50 ~ 200 mg/L, and the concentration of inhibitor was 100 ~ 1 000 mg/L.. When the cathode current density is 3.5A / dm ~ 2, the depth plating ability of the sample thickness 2.0 mm, hole diameter 0.3 mm, coating can be up to 700.The analytical method of the photoagent is established by cyclic voltammetry, and the amplification simulation experiment is carried out. The reliability of copper coating of optical agent system was studied by simulating VCP wire groove. The results show that when the cathode current density is 4.0 A / D ~ 2 and the aspect ratio of plate thickness 2.0 mm, is 10:1, the depth plating capacity of the six-point method can reach 64.26, which solves the problem of thin copper coating. The thermal shock resistance of the coating was at 288 鈩，
本文编号：2314851
[Abstract]:With the development of science and technology, the vertical continuous electroplating (VCP) line is widely used in the printed circuit board industry. Compared with the traditional gantry line, the VCP electroplating line has strong capacity of filling holes and good uniformity of copper plating due to continuous transmission. Therefore, a higher requirement is put forward for copper electroplating, that is, when the cathode current density is high, the through hole coating should have better deep plating ability, and the reliability of the through hole coating can satisfy the transmission of electrical signal. At present, the cathodic high current density deep plating capacity of domestic electroplating solution is generally low. Therefore, based on the process characteristics of VCP line, the research is applied to copper electroplating agent for VCP wire. The basic formula of acid copper-plating gloss agent was preliminarily screened in Hull trough and Harling trough. The concentration of brightener was 10 ~ 40 mg/L, the concentration of inhibitor was 50 ~ 200 mg/L, and the concentration of inhibitor was 100 ~ 1 000 mg/L.. When the cathode current density is 3.5A / dm ~ 2, the depth plating ability of the sample thickness 2.0 mm, hole diameter 0.3 mm, coating can be up to 700.The analytical method of the photoagent is established by cyclic voltammetry, and the amplification simulation experiment is carried out. The reliability of copper coating of optical agent system was studied by simulating VCP wire groove. The results show that when the cathode current density is 4.0 A / D ~ 2 and the aspect ratio of plate thickness 2.0 mm, is 10:1, the depth plating capacity of the six-point method can reach 64.26, which solves the problem of thin copper coating. The thermal shock resistance of the coating was at 288 鈩，
本文编号：2314851
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