典型封装器件热应力分析及焊点疲劳寿命预测

发布时间：2018-11-07 19:50

【摘要】：微电子技术的飞速发展使得封装器件的热应力分析及焊点可靠性研究成为一个重要课题,目前器件级芯片的热应力分析与焊点的疲劳寿命预测主要通过理论计算、有限元仿真和热循环试验三种方法来实现,而理论计算中模型简化过于理想误差较大,热循环试验成本高且费时,有限元仿真没有一款专用平台,大型通用软件操作繁琐且存在很大的功能浪费,基于上述现状本文以典型封装器件为对象来开展研究工作。基于典型封装器件,对热应力分析方法进行系统研究,阐述了适用于器件级芯片热应力分析的基础理论,总结有限元仿真模拟的分析流程,归纳了常用的试验方法,并针对具体插装DIP器件,分别了进行理论计算和有限元仿真模拟,进行结果对比。根据封装器件热循环载荷下结构仿真的基本流程,选择支撑软件ANSYS和开发软件Borland C++Builder编写了一套专用于典型封装器件热应力应变分析及焊点疲劳寿命预测的定制软件,大大简化了操作过程,并利用具体实例验证软件的可行性与有效性,在此基础上结合子模型高级分析技术,在保证得到精确结果的同时,大大节约了求解时间。针对富士通公司的BGA-320P-M06芯片,考察了其热可靠性影响因素,研究了热循环载荷参数、器件结构几何尺寸及焊点的钎料成份对器件焊点疲劳寿命的影响,并利用响应曲面法得到了器件焊点疲劳寿命与焊点高度、焊点直径、基板厚度及基板尺寸的回归方程,并进行回归模型验证,为器件的设计制造提供参考。
[Abstract]:With the rapid development of microelectronic technology, thermal stress analysis and solder joint reliability research of packaging devices become an important subject. At present, thermal stress analysis and fatigue life prediction of solder joints are mainly based on theoretical calculation. The finite element simulation and thermal cycle test are realized by three methods. However, in theoretical calculation, the simplification of the model is too large, the cost of thermal cycle test is high and time-consuming, and there is no special platform for finite element simulation. The operation of large scale universal software is cumbersome and there is a lot of functional waste. Based on the above situation, this paper takes typical packaging devices as the object to carry out the research work. Based on typical packaging devices, the thermal stress analysis method is systematically studied, the basic theory suitable for thermal stress analysis of device level chips is expounded, the analysis flow of finite element simulation is summarized, and the common test methods are summarized. The theoretical calculation and finite element simulation are carried out for the specific DIP device, and the results are compared. According to the basic flow of structure simulation under the thermal cycling load of packaging devices, a set of customized software for thermal stress-strain analysis of typical packaging devices and prediction of fatigue life of solder joints is developed by selecting the supporting software ANSYS and developing software Borland C Builder. The operation process is greatly simplified, and the feasibility and effectiveness of the software are verified by a concrete example. Based on this, the high level analysis technology of submodel is combined to ensure the accurate results and save the solving time greatly. Based on Fujitsu BGA-320P-M06 chip, the influence factors of thermal reliability are investigated, and the effects of thermal cycle load parameters, device structure geometry and solder composition on the fatigue life of solder joint are studied. The regression equations of fatigue life, solder joint height, solder joint diameter, substrate thickness and substrate size are obtained by using the response surface method, and the regression model is verified, which provides a reference for the design and manufacture of the device.
【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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