力、电诱发表面扩散下内连导线中晶内微裂纹的演化
发布时间：2018-11-11 08:41
【摘要】：集成电路特征尺寸日益减小,随之而来的电子元器件可靠性问题受到很大关注,而内连导线中微结构的演化将大大影响其可靠性。本文基于微结构演化动力学的基本理论框架,建立有限单元法,对内连导线中微裂纹演化进行数值模拟。主要内容和结论如下:基于物质表面扩散与蒸发-凝结的经典理论及其弱解描述,分别推导表面张力和应力迁移、表面张力和电迁移驱动下内连导线中二维晶内微裂纹演化的有限元控制方程。依据分别建立的力、电作用下内连导线中晶内微裂纹模型,编制相应有限元程序,在充分验证该程序的精确度与可靠性的前提下,对微裂纹演化过程进行数值模拟。通过对应力迁移诱发表面扩散下内连导线中晶内微裂纹演化的数值模拟研究,得出如下结论:在对称拉压载荷下,椭圆形晶内微裂纹演化分节存在临界线宽、临界应力和临界形态比。随着线宽的减小、外载的增大或形态比的增大,微裂纹发生分节的时间都减小。通过对电迁移诱发表面扩散下内连导线中晶内微裂纹演化的数值模拟研究,发现如下规律:椭圆形晶内微裂纹演化分节存在临界线宽、临界电场和临界形态比。线宽的减小、电场和形态比的增大将有助于裂腔分节的发生并且还可加速微裂纹分节。
[Abstract]:The characteristic size of integrated circuits is decreasing day by day, and the reliability of electronic components has been paid much attention to, and the evolution of microstructures in internal conductors will greatly affect their reliability. Based on the basic theoretical framework of the dynamics of microstructural evolution, a finite element method is established to simulate the evolution of microcracks in interconnecting conductors. The main contents and conclusions are as follows: based on the classical theory of material surface diffusion and evaporation-condensation and its weak solution description, the surface tension and stress migration are derived respectively. The finite element governing equation of microcrack evolution in two-dimensional intergranular wire driven by surface tension and electromigration. According to the model of intragranular microcracks in interconnecting conductors under the force and electricity respectively, the corresponding finite element program is compiled, and the evolution process of microcracks is numerically simulated on the premise of fully verifying the accuracy and reliability of the program. Based on the numerical simulation of the evolution of microcracks in intergranular conductors induced by stress migration, it is concluded that the critical linewidth exists in the evolution of microcracks in elliptic grains under symmetrical tension and compression loads. Ratio of critical stress to critical form. With the decrease of line width, the increase of external load or the increase of morphology ratio, the time of microcrack segmentation decreases. Based on the numerical simulation of the evolution of microcracks in intergranular conductors induced by electromigration, it is found that the critical linewidth, the critical electric field and the critical morphology ratio exist in the evolution of microcracks in elliptical grains. The decrease of line width and the increase of electric field and shape ratio will contribute to the formation of the split cavity and accelerate the microcrack segmentation.
【学位授予单位】：南京航空航天大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN601
本文编号：2324337
[Abstract]:The characteristic size of integrated circuits is decreasing day by day, and the reliability of electronic components has been paid much attention to, and the evolution of microstructures in internal conductors will greatly affect their reliability. Based on the basic theoretical framework of the dynamics of microstructural evolution, a finite element method is established to simulate the evolution of microcracks in interconnecting conductors. The main contents and conclusions are as follows: based on the classical theory of material surface diffusion and evaporation-condensation and its weak solution description, the surface tension and stress migration are derived respectively. The finite element governing equation of microcrack evolution in two-dimensional intergranular wire driven by surface tension and electromigration. According to the model of intragranular microcracks in interconnecting conductors under the force and electricity respectively, the corresponding finite element program is compiled, and the evolution process of microcracks is numerically simulated on the premise of fully verifying the accuracy and reliability of the program. Based on the numerical simulation of the evolution of microcracks in intergranular conductors induced by stress migration, it is concluded that the critical linewidth exists in the evolution of microcracks in elliptic grains under symmetrical tension and compression loads. Ratio of critical stress to critical form. With the decrease of line width, the increase of external load or the increase of morphology ratio, the time of microcrack segmentation decreases. Based on the numerical simulation of the evolution of microcracks in intergranular conductors induced by electromigration, it is found that the critical linewidth, the critical electric field and the critical morphology ratio exist in the evolution of microcracks in elliptical grains. The decrease of line width and the increase of electric field and shape ratio will contribute to the formation of the split cavity and accelerate the microcrack segmentation.
【学位授予单位】：南京航空航天大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN601
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