PCB用黑孔液组成及其制备的研究
发布时间：2018-11-17 08:54
【摘要】：目前印刷电路板层间的连接是通过孔金属化实现的,传统的孔金属化工艺采用的是化学镀铜技术,不符合现如今绿色产业化的要求。本文采用静电吸附的方法对印刷电路板微孔导电化处理,具体方法是以碳黑为导电介质,通过表面活性剂分散碳黑制备出黑孔液,经黑孔化处理的基材表面吸附碳导电层,从而实现直接电镀铜。本文对三种具有代表性的碳黑进行了筛选,对其表面化学性质、润湿性能、沉铜性能等方面进行了研究,发现M1300碳黑的水润湿性及表面沉铜性优于其它两种。同时,本文对实验选用的阴离子表面活性剂壬基酚聚氧乙烯醚磷酸酯的添加量及与其他表面活性剂的混合使用效果进行了优化,发现当壬基酚聚氧乙烯醚磷酸酯的添加为碳黑量的50%时,体系的透过率最低,离心稳定性最好;壬基酚聚氧乙烯醚磷酸酯与其它表面活性剂混合使用时,发现羧甲基纤维素钠与壬基酚聚氧乙烯醚磷酸酯具有协同分散的作用。对黑孔液p H值影响的研究中发现,当控制p H值为9~11时,碳黑的分散性能及对基材的吸附性能均较好。采用球磨分散2.5h为最佳分散工艺。采用最佳黑孔化工艺处理PCB的板面和孔壁,得到了结合力良好的沉铜层。研究了铜在酸性镀铜液中的沉积行为,发现其属于扩散控制。通过对不同阶跃电位下的电流-时间暂态曲线的研究,发现铜在电结晶初期按三维生长方式进行,在低的过电位下,铜电结晶初期按瞬时成核方式进行,高的过电位下,由于镀液中的添加剂以及碳黑层上的表面活性剂的影响,使得铜电结晶初期偏离了瞬时成核生长。
[Abstract]:At present, the interlayer connection of printed circuit board is realized by hole metallization. The traditional hole metallization technology adopts electroless copper plating technology, which does not meet the requirement of green industrialization nowadays. In this paper, the electrostatic-adsorption method is used to prepare black pore liquid by using carbon black as conductive medium, and the carbon conductive layer is adsorbed on the surface of the substrate treated by black pore treatment, in which carbon black is used as the conductive medium, and the black pore liquid is prepared by dispersing carbon black as the conductive medium. Thus, direct copper plating is realized. In this paper, three kinds of representative carbon black were screened. The surface chemical properties, wettability and copper deposition properties of M1300 carbon black were studied. It was found that the water wettability and surface copper deposition of M1300 carbon black were better than the other two. At the same time, the amount of anionic surfactant nonylphenol polyoxyethylene ether phosphate and its mixing effect with other surfactants were optimized. It was found that the system had the lowest transmittance and the best centrifugal stability when the addition of nonylphenol polyoxyethylene ether phosphate was 50% carbon black. When nonylphenol polyoxyethylene ether phosphate was mixed with other surfactants, it was found that sodium carboxymethyl cellulose and nonylphenol polyoxyethylene ether phosphate had synergistic dispersion effect. The influence of pH value on black pore liquid was studied. It was found that when pH value was 9 ~ 11:00, the dispersion property of carbon black and the adsorption property of carbon black on substrate were better. The best dispersing process was the ball milling and dispersing for 2.5 h. The best black hole process was used to treat the plate and hole wall of PCB, and a fine copper deposition layer with good adhesion was obtained. The deposition behavior of copper in acid copper plating solution was studied and it was found that it belongs to diffusion control. Through the study of current-time transient curves at different step potentials, it is found that copper is grown in three dimensional mode at the initial stage of electrocrystallization, in the low overpotential, in the initial stage of copper crystallization in the mode of instantaneous nucleation, and in the case of high overpotential. Due to the influence of the additives in the bath and the surfactant on the carbon black layer, the initial phase of copper electrocrystallization deviates from the instantaneous nucleation growth.
【学位授予单位】：哈尔滨工业大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN41
，
本文编号：2337212
[Abstract]:At present, the interlayer connection of printed circuit board is realized by hole metallization. The traditional hole metallization technology adopts electroless copper plating technology, which does not meet the requirement of green industrialization nowadays. In this paper, the electrostatic-adsorption method is used to prepare black pore liquid by using carbon black as conductive medium, and the carbon conductive layer is adsorbed on the surface of the substrate treated by black pore treatment, in which carbon black is used as the conductive medium, and the black pore liquid is prepared by dispersing carbon black as the conductive medium. Thus, direct copper plating is realized. In this paper, three kinds of representative carbon black were screened. The surface chemical properties, wettability and copper deposition properties of M1300 carbon black were studied. It was found that the water wettability and surface copper deposition of M1300 carbon black were better than the other two. At the same time, the amount of anionic surfactant nonylphenol polyoxyethylene ether phosphate and its mixing effect with other surfactants were optimized. It was found that the system had the lowest transmittance and the best centrifugal stability when the addition of nonylphenol polyoxyethylene ether phosphate was 50% carbon black. When nonylphenol polyoxyethylene ether phosphate was mixed with other surfactants, it was found that sodium carboxymethyl cellulose and nonylphenol polyoxyethylene ether phosphate had synergistic dispersion effect. The influence of pH value on black pore liquid was studied. It was found that when pH value was 9 ~ 11:00, the dispersion property of carbon black and the adsorption property of carbon black on substrate were better. The best dispersing process was the ball milling and dispersing for 2.5 h. The best black hole process was used to treat the plate and hole wall of PCB, and a fine copper deposition layer with good adhesion was obtained. The deposition behavior of copper in acid copper plating solution was studied and it was found that it belongs to diffusion control. Through the study of current-time transient curves at different step potentials, it is found that copper is grown in three dimensional mode at the initial stage of electrocrystallization, in the low overpotential, in the initial stage of copper crystallization in the mode of instantaneous nucleation, and in the case of high overpotential. Due to the influence of the additives in the bath and the surfactant on the carbon black layer, the initial phase of copper electrocrystallization deviates from the instantaneous nucleation growth.
【学位授予单位】：哈尔滨工业大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN41
，
本文编号：2337212
本文链接：https://www.wllwen.com/kejilunwen/dianzigongchenglunwen/2337212.html
