一种在芯片测试阶段进行产品规格区分的方法
发布时间：2019-05-27 04:26
【摘要】：介绍了逻辑电路IC芯片的两项重要参数(性能和功耗)与芯片的通用电源短路测试参数之间的强相关性。从而在IC芯片的量产阶段,利用晶圆测试阶段的通用电源短路参数进行分类的方法,来区分出不同性能和功耗规格要求的产品。在此基础上,根据通用电源短路参数的不同分类,在芯片内部的电熔丝里烧录不同的电压标识,使得芯片可以在系统上启动BIOS时通过读取该电压标识来决定运行芯片的电压大小,从而有助于优化产品的性能与功耗分布,进而提高产品的规格。
[Abstract]:This paper introduces the strong correlation between two important parameters (performance and power consumption) of logic circuit IC chip and the general power supply short circuit test parameters of the chip. Therefore, in the mass production stage of IC chip, the general power short circuit parameters of wafer test stage are used to classify the products with different performance and power consumption specifications. On this basis, according to the different classification of short circuit parameters of general power supply, different voltage marks are burned in the electric fuse inside the chip. So that the chip can determine the voltage of the running chip by reading the voltage identification when the BIOS is started on the system, which is helpful to optimize the performance and power consumption distribution of the product, and then improve the specification of the product.
【作者单位】： 上海兆芯集成电路有限公司;
【分类号】：TN407
，
本文编号：2485901
[Abstract]:This paper introduces the strong correlation between two important parameters (performance and power consumption) of logic circuit IC chip and the general power supply short circuit test parameters of the chip. Therefore, in the mass production stage of IC chip, the general power short circuit parameters of wafer test stage are used to classify the products with different performance and power consumption specifications. On this basis, according to the different classification of short circuit parameters of general power supply, different voltage marks are burned in the electric fuse inside the chip. So that the chip can determine the voltage of the running chip by reading the voltage identification when the BIOS is started on the system, which is helpful to optimize the performance and power consumption distribution of the product, and then improve the specification of the product.
【作者单位】： 上海兆芯集成电路有限公司;
【分类号】：TN407
，
本文编号：2485901
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