某高码率通信终端处理机热设计与仿真分析
发布时间：2021-08-10 00:14
处理机是飞行器高码率通信终端核心电子设备,处理机稳定性与可靠性的高低直接关系到整个终端系统设备的可靠性工作。介绍高码率通信终端处理机热设计的特点与方法,针对不同的功率器件和组件,与结构设计相结合,探索合理的散热途径,特别是许多热耗较大的功率器件的热设计。通过热仿真分析,优化热设计方案,控制每个器件的温升满足设计要求,并进行了热真空、热平衡试验验证。
【文章来源】：遥测遥控. 2020,41(01)
【文章页数】：8 页
【部分图文】：
处理机散热路径图Fig.3Heatdissipationpathofprocessor作可靠性。所示
2020年1月遥测遥控·55·图4调制解调模块温度云图Fig.4Temperaturenephogramofmodemmodule图5激光收发模块温度云图Fig.5Temperaturenephogramoflasertransceivermodule图6综合接口与伺服控制模块温度云图Fig.6Temperaturecloudofintegratedinterfaceandservocontrolmodule图7供配电模块温度云图Fig.7Temperaturecloudofpowersupplyanddistributionmodule表1高温工况计算结果Table1Calculationsofhightemperatureconditions所属模块序号元器件名称热耗（W）结壳热阻（℃/W）壳温（℃）结温（℃）I级降额温度（℃）调制解调模块1电源模块LDO-10.5745.8649.36852频综-10.553049.2665.76853频综-20.753055.7078.20854频综-30.83055.4279.42855信道_WG1.45/49.27/856放大器0.39052.8979.8985D1AD6.354.358.6085.9185D2DA1.63.350.8556.1385D3FPGA150.2459.8463.4485D4LDO-10.83.761.4864.4485D5收发器10.42.9657.8359.0285D5收发器20.42.9658.1859.3685D6LDO-20.83.761.0263.9885D7LDO-30.323.754.5455.7285D8DC/DC-10.40.5264.4964.7085D9DC/DC-210.5278.7279.2485
2020年1月遥测遥控·55·图4调制解调模块温度云图Fig.4Temperaturenephogramofmodemmodule图5激光收发模块温度云图Fig.5Temperaturenephogramoflasertransceivermodule图6综合接口与伺服控制模块温度云图Fig.6Temperaturecloudofintegratedinterfaceandservocontrolmodule图7供配电模块温度云图Fig.7Temperaturecloudofpowersupplyanddistributionmodule表1高温工况计算结果Table1Calculationsofhightemperatureconditions所属模块序号元器件名称热耗（W）结壳热阻（℃/W）壳温（℃）结温（℃）I级降额温度（℃）调制解调模块1电源模块LDO-10.5745.8649.36852频综-10.553049.2665.76853频综-20.753055.7078.20854频综-30.83055.4279.42855信道_WG1.45/49.27/856放大器0.39052.8979.8985D1AD6.354.358.6085.9185D2DA1.63.350.8556.1385D3FPGA150.2459.8463.4485D4LDO-10.83.761.4864.4485D5收发器10.42.9657.8359.0285D5收发器20.42.9658.1859.3685D6LDO-20.83.761.0263.9885D7LDO-30.323.754.5455.7285D8DC/DC-10.40.5264.4964.7085D9DC/DC-210.5278.7279.2485
本文编号：3333057
【文章来源】：遥测遥控. 2020,41(01)
【文章页数】：8 页
【部分图文】：
处理机散热路径图Fig.3Heatdissipationpathofprocessor作可靠性。所示
2020年1月遥测遥控·55·图4调制解调模块温度云图Fig.4Temperaturenephogramofmodemmodule图5激光收发模块温度云图Fig.5Temperaturenephogramoflasertransceivermodule图6综合接口与伺服控制模块温度云图Fig.6Temperaturecloudofintegratedinterfaceandservocontrolmodule图7供配电模块温度云图Fig.7Temperaturecloudofpowersupplyanddistributionmodule表1高温工况计算结果Table1Calculationsofhightemperatureconditions所属模块序号元器件名称热耗（W）结壳热阻（℃/W）壳温（℃）结温（℃）I级降额温度（℃）调制解调模块1电源模块LDO-10.5745.8649.36852频综-10.553049.2665.76853频综-20.753055.7078.20854频综-30.83055.4279.42855信道_WG1.45/49.27/856放大器0.39052.8979.8985D1AD6.354.358.6085.9185D2DA1.63.350.8556.1385D3FPGA150.2459.8463.4485D4LDO-10.83.761.4864.4485D5收发器10.42.9657.8359.0285D5收发器20.42.9658.1859.3685D6LDO-20.83.761.0263.9885D7LDO-30.323.754.5455.7285D8DC/DC-10.40.5264.4964.7085D9DC/DC-210.5278.7279.2485
2020年1月遥测遥控·55·图4调制解调模块温度云图Fig.4Temperaturenephogramofmodemmodule图5激光收发模块温度云图Fig.5Temperaturenephogramoflasertransceivermodule图6综合接口与伺服控制模块温度云图Fig.6Temperaturecloudofintegratedinterfaceandservocontrolmodule图7供配电模块温度云图Fig.7Temperaturecloudofpowersupplyanddistributionmodule表1高温工况计算结果Table1Calculationsofhightemperatureconditions所属模块序号元器件名称热耗（W）结壳热阻（℃/W）壳温（℃）结温（℃）I级降额温度（℃）调制解调模块1电源模块LDO-10.5745.8649.36852频综-10.553049.2665.76853频综-20.753055.7078.20854频综-30.83055.4279.42855信道_WG1.45/49.27/856放大器0.39052.8979.8985D1AD6.354.358.6085.9185D2DA1.63.350.8556.1385D3FPGA150.2459.8463.4485D4LDO-10.83.761.4864.4485D5收发器10.42.9657.8359.0285D5收发器20.42.9658.1859.3685D6LDO-20.83.761.0263.9885D7LDO-30.323.754.5455.7285D8DC/DC-10.40.5264.4964.7085D9DC/DC-210.5278.7279.2485
本文编号：3333057
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