当前位置:主页 > 科技论文 > 化工论文 >

金掺杂降低碳纳米管接触电阻的实验研究

发布时间:2018-05-02 00:08

  本文选题:复合材料 + 碳纳米管 ; 参考:《材料研究学报》2017年07期


【摘要】:降低与金属之间的接触电阻是碳纳米管在微纳电子领域获得应用的前提,掺杂金纳米粒子可有效降低碳纳米管的接触电阻。本文采用高温焙烧在碳纳米管表面构造缺陷和亲水基团,然后将碳纳米管在氯金酸水溶液中超声浸泡以吸附氯金酸,再在氢气气氛下加热还原氯金酸为金。扫描电子显微(SEM)图片表明碳纳米管被成功地掺杂了金纳米粒子,X射线能量散射谱(EDS)和X射线光电子谱(XPS)表明金是唯一掺杂在碳纳米管上的粒子。掺杂后碳纳米管的拉曼光谱中G带波数降低说明对碳纳米管掺杂金为N型掺杂。N型掺杂剂将电子转移给邻近的碳原子,使碳纳米管中的电子数量增加,进而增强了碳纳米管的导电性。利用介电电泳法将碳纳米管组装到一对金电极之间,并使用精密电感电容电阻(LCR)测试仪实时测量。结果表明碳纳米管与金电极之间的接触电阻较掺杂前得到了有效改善,电阻值最大可降低近50%。
[Abstract]:Reducing the contact resistance with metals is the prerequisite for the application of carbon nanotubes in the field of micro-nano electronics. Gold doped nanoparticles can effectively reduce the contact resistance of carbon nanotubes. In this paper, defects and hydrophilic groups on the surface of carbon nanotubes were calcined at high temperature. Then the carbon nanotubes were immersed in chlorgold acid solution in ultrasonic to adsorb chlorogold acid, and then heated to reduce the chlorgold acid to gold in hydrogen atmosphere. Scanning electron microscopy (SEM) images show that carbon nanotubes are successfully doped with gold nanoparticles (EDS) and X-ray photoelectron spectroscopy (XPSS), indicating that gold is the only particle doped on carbon nanotubes. The decrease of G-band number in the Raman spectra of the doped carbon nanotubes indicates that the electrons in the carbon nanotubes are transferred to the adjacent carbon atoms by the N-type doped gold doping agent, which increases the number of electrons in the carbon nanotubes. Furthermore, the conductivity of carbon nanotubes is enhanced. Carbon nanotubes (CNTs) were assembled between a pair of gold electrodes by dielectric electrophoretic method, and real-time measurement was carried out by using a precise inductance capacitance resistance (LCR) tester. The results show that the contact resistance between the carbon nanotubes and the gold electrode is improved effectively, and the maximum resistance value can be reduced by nearly 50%.
【作者单位】: 华北理工大学机械工程学院;华北理工大学理学院;华北理工大学材料科学与工程学院;
【基金】:国家自然科学基金(51172062,51472074) 华北理工大学研究生创新项目(2016S14)~~
【分类号】:TQ127.11

【相似文献】

相关期刊论文 前5条

1 R.G.Baker;T.A.Palumbo;刘立余;;钌在电子工业中的应用潜力[J];贵金属;1985年04期

2 齐文凯;;电解槽阳极接触电阻测量方法比较[J];氯碱工业;1990年04期

3 К.К.Дубовиков;博长;;电极接头处接触电阻的模型[J];炭素技术;1988年02期

4 赖龙君,陈绍同;锡铈/DJB-823涂层代银[J];材料保护;1989年07期

5 谭俊;邢汝鑫;钱耀川;;磁控溅射CrNx薄膜的接触电阻及其耐腐蚀性能[J];中国表面工程;2010年06期



本文编号:1831581

资料下载
论文发表

本文链接:https://www.wllwen.com/kejilunwen/huagong/1831581.html


Copyright(c)文论论文网All Rights Reserved | 网站地图 |

版权申明:资料由用户9bb45***提供,本站仅收录摘要或目录,作者需要删除请E-mail邮箱bigeng88@qq.com