电化学方法回收废旧电路板制备高强高纯铜箔
发布时间：2018-11-09 18:30
【摘要】：采用六因素三水平的正交设计法优化工艺条件,确定用电沉积的方法从废旧印刷电路板(PCB)中提纯铜制备高强高纯铜箔的最佳工艺条件。采用扫描电镜(SEM)、X射线衍射仪(XRD)和电感耦合等离子发射光谱分析仪(ICP)对最优条件下制备的铜箔进行表征;并对此铜箔的力学、电学性能和耐腐蚀性能进行研究。结果表明,在酸性硫酸铜溶液中,采用脉冲电源,40℃下,当周期为50 ms,占空比为0.95,电流密度为50 m A·cm~(-2),添加剂十二烷基硫酸钠(SDS)1.5 g·L~(-1)和聚乙二醇(PEG)20 g·L~(-1)时,可制备出厚度低于15μm的表面光滑均匀的铜箔,铜箔纯度为99.91%。其微观形貌为紧密堆积的圆形颗粒,平均晶粒尺寸为60 nm,具有明显的(111)晶面择优取向。铜箔强度为337MPa,电阻率为2.8×10~(-6)Ω·cm,耐腐蚀性能优异。采用电化学方法回收废旧电路板金属制取的产品附加值高,工艺简单环保,而且铜的回收率可以达到67%以上。
[Abstract]:The orthogonal design method with six factors and three levels was used to optimize the process conditions and to determine the optimum process conditions for the preparation of high strength and high purity copper foil from waste printed circuit board (PCB) by electrodeposition method. (SEM), X ray diffractometer (XRD) and inductively coupled plasma emission spectrometer (ICP) were used to characterize the copper foil prepared under the optimum conditions, and the mechanical, electrical and corrosion resistance of the copper foil were studied. The results show that the current density is 50 Ma cm~ (-2) when the period is 0.95 ms, and the period is 0.95 at 40 鈩，
本文编号：2321217
[Abstract]:The orthogonal design method with six factors and three levels was used to optimize the process conditions and to determine the optimum process conditions for the preparation of high strength and high purity copper foil from waste printed circuit board (PCB) by electrodeposition method. (SEM), X ray diffractometer (XRD) and inductively coupled plasma emission spectrometer (ICP) were used to characterize the copper foil prepared under the optimum conditions, and the mechanical, electrical and corrosion resistance of the copper foil were studied. The results show that the current density is 50 Ma cm~ (-2) when the period is 0.95 ms, and the period is 0.95 at 40 鈩，
本文编号：2321217
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