含硅芳炔单体的流变性及聚合物热分解

发布时间：2018-03-15 11:25

  本文选题：苯基三苯乙炔基硅烷　切入点：乙烯基三苯乙炔基硅烷　出处：《固体火箭技术》2016年05期 　论文类型：期刊论文

【摘要】：借助流变仪研究了苯基三苯乙炔基硅烷(PTPES)、乙烯基三苯乙炔基硅烷(VTPES)、二苯基二苯乙炔基硅烷(BPBPES)3种单体及其聚合物(TSAR)的流变性能,并利用热分析技术分析了共聚物的反应动力学,建立了热分解机理函数。流变分析表明,3种单体加工窗口超过150℃,具有良好的加工性能;热重分析显示,800℃时聚合物残炭率在70%左右;8种动力学分析证实,聚合物热分解反应级数n=4,反应活化能E=131.2 k J/mol。
[Abstract]:By means of rheometer, the rheological properties of three monomers, phenyltriphenylacetylsilane, vinyltriphenylacetylsilane, diphenyl diphenylethynylsilane and its polymer TSAR, were studied, and the reaction kinetics of the copolymers was analyzed by means of thermal analysis. The mechanism function of thermal decomposition was established. The rheological analysis showed that the processing windows of the three monomers were above 150 鈩，

本文编号：1615823